Trends of Electronic Packaging and Characteristics Evaluation by Shape of Solder Joints
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신영의
(중앙대학교 기계공학부)
고영욱 (중앙대학교 기계공학부) 김종민 (오사카대학 공학연구과 생산과학) 윤종구 (산업자원부 기술표준원 전자표준과) |
| 1 |
Solder Joint Similarities between BGA/CSP and Other Surface Mount Devices
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| 2 |
A Study on the Life Prediction and Quality Improvement of Solder Joint in IC Package
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과학기술학회마을 |
| 3 |
Effect of strain Rate, Hold Time and Third Element on the Fatigue Damage of Sn-3.5mass%Ag Alloy
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| 4 |
Characterization of Chip Scale Packaging Materials
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DOI ScienceOn |
| 5 |
Three-Dimensional Versus Two Dimensional Finite Element Modeling of Flip-Chip Packages
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| 6 |
Estimate the Thermomechanical Fatigue Life of Two Chip Scale Packages
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| 7 |
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| 8 |
A Study of the Effect of Cyclic Thermal Stress on a Ductile Metal
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| 9 |
Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling
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| 10 |
An Overview of Solder Bump Shape Prediction Algorithms with Validations
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| 11 |
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| 12 |
Shape prediction and Resicual Stress Evaluation of BGA and Flip Chip Solder Joints
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| 13 |
Solder Joint Fatigue Models : review and applicability to chip scale package
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DOI ScienceOn |
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