Vibration Reduction of Chip-Mount System

칩 마운트 시스템의 진동 경감

  • 임경화 (한국기술교육대학교 제어시스템공학과) ;
  • 장헌탁 (한국기술교육대학교 제어시스템공학과)
  • Published : 2001.11.01

Abstract

The purpose of this study is to analyze the principal causes of vibration problem and find out the method of vibration reduction in a chip-mount system. The principal causes are investigated through measurements of vibration spectrum and model parameters. Modal parameters are obtained by using an experimental model test. Based on the model parameters from experiments. a model of finite element method is formulated. The model presents effective redesign of increasing the natural frequencies in order to reduce the vibration of a chip-mount system. Further, through computer simulation for the behavior of head to be main vibration source, the best acceleration pattern of head movement can be verified to achieve effective head-positioning and reduce the vibration due to head movement.

Keywords

References

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