참고문헌
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- IEEE Trans. On Components, Hybrids, and Manufacturing Technology v.20 Adhesion Issues in Epoxy Based Chop Attach Adhesives Pearson,R.A.;Liod,T.B.;Azimi,H.R.
- 석사학위논문, 한국과학기술원 칩과 리드프레임 사이의 계며파괴인성치에 대한 실험적 고찰 이새봄
- International Journal of Solids and Structures v.35 Boundary Element Analysis of the Stress Singularity at the Interface Corner of Viscoelastic Adhesjve Layers Lee,S.S.
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- 대한기계학회논문집 A권 v.22 no.3 점탄성을 고려한 플라스틱 IC패키지의 파손해석 이강용;양지혁
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