• Journal of the Computational Structural Engineering Institute of Korea
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• v.14 no.3
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• pp.309-315
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• 2001

The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

• Computational Structural Engineering
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• v.10 no.1
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• pp.129-134
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• 1997

Interfacial stress singularity in a unidirectional two-dimensional laminate model consisting of an elastic fiber and a viscoelastic matrix has been investigated using the time-domain boundary element method. First, the interfacial singular stresses between the fiber and the matrix of a unidirectional laminate subjected to a uniform transverse tensile strain have been investigated near the free surface, but without any defect or any edge crack. Such a stress singularity might lead to fiber-matrix debonding or interfacial edge cracks. Then, the overall stress intensity factor for the case of a small interfacial edge crack of length a has been computed.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.25-30
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• 2001

The stress intensity factors for edge cracks located at the bonding interface between the semiconductor chip and the adhesive layer subjected to a uniform transverse tensile strain are investigated. Such cracks might be generated due to a stress singularity in the vicinity of the free surface. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. The amplitude of complex stress intensity factor depends on the crack length, but it has a constant value at large crack lengths. The rapid propagation of interface crack is expected if the transverse tensile strain reaches a critical value.

• Composites Research
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• v.16 no.5
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• pp.45-53
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• 2003

The experimental and numerical investigations on the failure characteristics of the secondary bonded composite single-lap joints were performed. The initiations and growths of cracks were observed using CCD camera and acoustic emission sensor during the tension tests of the joint specimens. The structural behaviors of the specimens were predicted by the geometric nonlinear two-dimensional finite element analysis. The three types of observed initial cracks were included in each finite element models and the strain energy release rates of each specimen models were calculated by VCCT(Virtual Crack Closure Technique) technique. The tension tests showed that the initial cracks occurred in the 60∼90% of final failure loads and the major failure modes of the specimens were adhesive failure and the delamination between the 1st and 2nd ply of laminate. The specimens with the thicker bondline had earlier crack initiation loads but higher crack propagation resistance and eventually better loading capability. The delaminations were mostly observed in the thicker bondline specimens. The mode I values of calculated strain energy release rates were higher than the mode II values in the all specimen models considering the three types of initial cracks. The mode I and total strain energy release rates were calculated as higher values in the order of initial crack in the edge interface, comer interface and delamination between the plies of laminate.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.31-35
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• 2000

The stress state developed in a thin adhesive layer bonded between the semiconductor chip and the leadframe and subjected to a shear loading is investigated. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. Within the context of a linear elastic theory, a stress singularity of type $\gamma^{\lambda=1}$(0<1<1) exists at the point where the interface between one of the rigid adherends and the adhesive layer intersects the free surface. Such singularity might lead to edge crack or delamination.

• Composites Research
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• v.19 no.4
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• pp.15-22
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• 2006

One of the primary factors limiting the application of composite-metal adhesively bonded joints in structural design is the lack of a good evaluation tool for the interfacial strength to predict the load bearing capacity of boned joints. In this paper composite-steel adhesion strength is evaluated in terms of stress intensity factor and fracture toughness of the interface corner. The load bearing capacity of double lap joints, fabricated by co-cured bonding of composite-steel adherends has been determined using fracture mechanical analysis. Bi-material interface comer stress singularity and its order are presented. Finally stress intensities and fracture toughness of the wedge shape bi-material interface corner are determined. Double lap joint failure locus and its mixed mode crack propagation criterion on $K_1-K_{11}$ plane have been developed by tension tests with different bond lengths.

• Korean Journal of Materials Research
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• v.3 no.3
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• pp.282-291
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• 1993

Joining ${Al}_{2}{O}_{3}$ and STS 304 stainless steel by active metal brazing method with using CuI Owt % Ti and Cu -7 .5wt % Zr insert metal, their interfaces were analyzed and strength of the joint brazed with Cu-7.5wt % Zr insert metal also investigated with shear strength testing method. In brazing with Cu-lOwt% Ti insert metal, the single reaction layer was formed by the reaction with Ti and ${Al}_{2}{O}_{3}$ at the interface between ${Al}_{2}{O}_{3}$ and insert metal, but the double reaction layer was found in brazing with Cu-7.5wt % Zr insert metal because of the difference of their wettability on the surface of ${Al}_{2}{O}_{3}$. Fracture shear strength about 86MPa was obtained from ${Al}_{2}{O}_{3}$/Cu-7.5wt% Zr/STS 304 stainless steel joint and reasonable strength of the joints is attributed to the formation of double reaction layer at the interface.