Paratic Impedance Extraction of FC-PGA Package Pin using the Static Fast Multipole Method

Static FMM을 이용한 FC-PGA 패키지 핀에서의 기생 임피던스 추출

  • 천정남 (한양대학교 전자전기 공학부) ;
  • 이정태 (현대자동차 전자시험팀) ;
  • 어수지 (한양대학교 전자전기 공학부) ;
  • 김형동 (한양대학교 전자전기 공학부)
  • Published : 2001.12.01

Abstract

In this paper, the FMM(Fast Multipole Method) combined with GMRES(Generalized Minimal RESidual Method) matrix solver is used to extract the parasitic impedance for complicated 3-D structures in uniform dielectric materials which limit the use of MoM(Method of Moment) due to its large computation time and memory requirement. This algorithm is a fast multipole-accelerated method based on quasistatic analysis and is very efficient for computing impedance between conductors. This paper proved the accuracy and efficiency of the FMM by comparing with MoM in simple examples. Finally the parasitic impedance of FC-PGA(Flip Chip Pin Grid Array) Package pins has been extracted by this algorithm and we have considered the possibility of the EMI/EMC problem caused by the signal interference.

본 논문에서는 균일한 유전체 내의 복잡한 3차원 구조체에 대한 효율적인 기생(Parasitic) 임피던스 성분 추출을 위하여 반복법의 일종인 GMRES(Generalized Minimal RESidual Method)와 결합된 고속 멀티폴(FMM : Fast Multipole Method) 알고리즘을 구현하였다. 이 알고리즘은 준정적 기반 고속 멀티폴 방법으로 다중 도체들 간의 임피던스를 계산하는데 있어 기존의 모멘트법(MoM: Method of Moment)이 가지고 있는 계산량과 시간의 문제를 극복하기 위한 고속화 기술이다. 본 논문에서는 기존 MoM과의 비교를 통해 FMM의 정확성과 효율성을 입증하였다. 또한 멀티폴 알고리즘을 이용하여 기존 MoM으로는 해석이 불가능한 FC-PGA (Flip Chip Pin Grid Array) 패키지 핀에서의 기생 임피던스 성분들을 추출함으로써 신호간의 간섭에 의한 EMI/EMC 문제의 발생 가능성을 확인하였다.

Keywords

References

  1. IEEE Trans. On Electromagnetic Compatibility v.38 no.4 Investigation of Fundamental EMI Source Mechanisms Driving Common-mode Radiation from Printed Circuit Boards with Attached Cables D. Hokanson;J. Drewniak;T. Hubing;Van. Doren;Fei Sha;M. Wilhelm
  2. SIAM J. Scientific Statistical Computing v.7 no.3 GMRES: A Generalized Minimal Residual Algorithm for Solving Nonsymmetric Linear System Y. Saad;M. H. Schultz
  3. IEEE Trans. On Computer Aided Design Integrated Circuits and Systems v.10 FastCap: A Multipole Accelerated 3-D Capacitance Extraction Program K. Nabors;J. White
  4. IEEE Trans. On Microwave Theory and Technique v.42 no.9 Fast-Henry: A Multipole Accelerated 3-D Inductance Extraction Program M. Kamon;M. J. Tsuk;J. White
  5. Field Computation by Moment Methods R. Harrington
  6. Fields and Waves in Communication Electronics(3rd Edition) S. Ramo;J. Whinnery;T. Duzer
  7. IEEE Trans. On Advanced Packaging v.22 no.2 Frequency Response Characteristics of Reference Plane Effective Inductance and Resistance Xuebing Xie;John L. Prince
  8. IEEE Trans. On Components, Packaging, And Manufacturing Technology-Part B v.21 no.4 Effect of Floating Plane in Three-Dimensional Packaging Structures on Simultaneous Switching Noise Loizos Vakanas;Samil Hasan;Andreas Cangellaris;John L. Prince
  9. IEEE Trans. On Advanced Packaging v.22 no.2 RF Flip-Module BGA Package Yee L. Low;Yinon Degani;Keith V. Guinn;T. Dixon Dudderrar;Jeffrey A. Gregus;Robert C. Frye
  10. IEEE Trans. On Components, Packaging, And Manufacturing Technology-Part B v.21 no.3 Automatic Generation of Accurate Circuit Models of 3-D Interconnect Mattan Kamon;Nuno Alexandre Marques;Luis Miguel Silveria;Jacob White