References
- 전기학회논문지 v.1 Si-tip FEA의 제조 및 동작 특성 평가 주병권;이상조;이윤희;전동렬;오명환
- 전기학회논문지 Si-tip FEA에 있어서 DLC 코팅이 전계 방출 특성에 미치는 영향 주병권;이상조;이윤희;전동렬;오명환
DLC film remaining on device surface could be removed by eliminating AI sacrificial layer as a final step of lift-off process in the fabrication of DLC-coated Si-tip FEA. The field emission properties(I-V curves, hysteresis, and current fluctuation etc.) of the processed device were analyzed and the process was employed to 1.76 inch-sized FEA panel fabrication in order to evaluate its FED applicability.