Journal of the Korean Society for Precision Engineering (한국정밀공학회지)
- Volume 15 Issue 1
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- Pages.43-50
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- 1998
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- 1225-9071(pISSN)
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- 2287-8769(eISSN)
Visco-Elastic Fracture Analysis of IC Package under Thermal Loading
열하중하에 있는 IC 패키지의 점탄성 파괴해석
Abstract
The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.
Keywords