E2M - 전기 전자와 첨단 소재 (Electrical & Electronic Materials)
- 제8권2호
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- Pages.171-175
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- 1995
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- 2982-6268(pISSN)
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- 2982-6306(eISSN)
직교배열표를 쓴 remote-PECVD 산화막형성의 공정최적화 및 특성
Optimization of remote plasma enhanced chemical vapor deposition oxide deposition process using orthogonal array table and properties
초록
Optimum condition of remote plasma enhanced chemical vapor deposition using orthogonal array method was chosen. Characteristics of oxide films deposited by RPECVD with SiH
키워드