Fabrication of FIPOS-SOI Using $n/p^+/p$ Structure

$n/p^+/p$구조를 이용한 FIPOS-SOI의 제조

  • 양천순 (경북대학교 전자공학과) ;
  • 이종현 (경북대학교 전자공학과)
  • Published : 1989.12.01

Abstract

A SOI was fabricated by the FIPOS technique using n/p+/p silicon structure. Fabricated silicon island which has 3\ulcorner thickness and 100\ulcorner width was investigated by measuring van der Pauw resistivity, Hall mobility, dielectric breakdown voltage and leakage current. Hall mobility of the SOI was measured to be 300-500cm\ulcornerV.sec and its breakdown field was 1-2 MV/cm. The cross-sectional geometries of the SOI island were examined by SEM and optical microscope.

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