Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Analysis of LED reliability using SPICE-based 3-dimensional circuit model

3차원 SPICE 회로모델을 이용한 LED 신뢰성 분석

  • Kim, Jin-Hwan (Dept. of Electronic, Information and Communication Engineering Hongik University) ;
  • Yu, Soon-Jae (Dept. of Electronic, Information and Communication Engineering Hongik University) ;
  • Seo, Jong-Wook (Dept. of Electronic, Information and Communication Engineering Hongik University)
  • 김진환 (홍익대학교 전자정보통신공학과) ;
  • 유순재 (홍익대학교 전자정보통신공학과) ;
  • 서종욱 (홍익대학교 전자정보통신공학과)
  • Published : 2008.06.18
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Abstract

A SPICE-based 3-dimensional circuit model of Light-Emitting Diode(LED) was modified include the reverse breakdown properties. The new model is found to be accurate to study the failure mechanisms of LEDs under electrostatic discharge (ESD) and electronic overstress (EOS). It was found that the permanent damages under heavy reverse stress is mainly due to the high electric field strength in P-GaN layer.

Keywords