Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 2008.06a
- /
- Pages.377-378
- /
- 2008
Studies on the Morphology of the CVD Tungsten Film
기상화학증착 텅스텐 막질의 표면 형태에 관한 연구
- Jeon, Dong-Soo (Samsung Semiconductor Institute of Technology) ;
- Kim, Sun-Rae (FAB 3 Team, Memory Division Samsung Electronics) ;
- Lee, Sung-Young (Product Quality Assurance Team Samsung Electronics) ;
- Park, Young-Kyou (FAB Equipment Development Team Samsung Electronics) ;
- Jeon, Young-Soo (FAB Equipment Development Team Samsung Electronics)
- 전동수 (삼성전자 공과대학교) ;
- 김선래 (삼성전자 MEMORY사업부 FAB3팀) ;
- 이성영 (삼성전자 MEMORY사업부 개발 QA팀) ;
- 박영규 (삼성전자 MEMORY사업부 설비개발팀) ;
- 전영수 (삼성전자 MEMORY사업부 설비개발팀)
- Published : 2008.06.18
Abstract
Morphology is one of important issues when developing a layer of CVD-W. we need to control the process more precisely that is filling gaps between BL(bit line)and DC(direct contact). Whereas we are facing to difficulties like not-filling contacts due to marginal problems in deposition and etching process. This paper is for investigating a method to resolve morphology problem with strengthening the condition of seasoning.
Keywords