Mechanical Behavior of Cu Nanowire under Cyclic Loading

반복하중을 받는 구리 나노 와이어의 기계적 거동

Molecular dynamics (MD) simulations are used to analyze behavior of copper nanowires under cyclic loading. The embedded atom method (EAM) potential is employed to represent atomic interaction. Cyclic load is applied in two ways (Forward Tension / Reverse Compression and Forward Compression / Reverse Tension). The results show that dislocations are piled up as a result of plastic deformation during alternate tensile and compressive loading. After cyclic loading with a change of direction, yield stress decreases in consequence of the effect by the dislocation pileups. On the other hand, under FC/RT cyclic load, phase transformation represent associated with mechanical twinning. And copper nanowire can return to almost former undeformed condition during tensile loading at 300K.