Proceedings of the KSME Conference (대한기계학회:학술대회논문집)

The Korean Society of Mechanical Engineers (대한기계학회)
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Fatigue Crack Propagation Behavior of Sn-3.0Ag-0.5Cu Solder Material

Sn-3.0Ag-0.5Cu 솔더재료의 피로 균열진전에 관한 연구

  • 우태욱 (포항공과대학교, 기계공학과) ;
  • 김광수 (포항공과대학교, 기계공학과) ;
  • ;
  • Published : 2008.11.05
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Abstract

This study investigates crack propagation behavior of Sn-3.0Ag-0.5Cu solder under pull-push loading conditions. Fatigue Crack Growth (FCG) tests were conducted on Center Cracked Plate (CCP) specimens in fast-fast (pp) strain waveform. The fast-slow (pc), slow-fast (cp) and slow-slow (cc) strain waveforms were also used to study the effect of strain rates. The crack propagation rates for the four strain waveforms were correlated with J-integral range and a scatter band of factor 4 was found. The crack growth rates for the pc waveform was highest, followed by cp, cc and then pp waveforms.

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