Fabrication of the Imaging Lens for Mobile Camera using Embossing Method

엠보싱 공법에 의한 카메라 모듈용 광학렌즈 성형기법에 대한 연구

  • 이청희 (삼성전기 중앙연구소 OS랩) ;
  • 진영수 (삼성전기 중앙연구소 OS랩) ;
  • 노정은 (삼성전기 중앙연구소 OS랩) ;
  • 김성화 (삼성전기 중앙연구소 OS랩) ;
  • 장인철 (삼성전기 중앙연구소 OS랩)
  • Published : 2007.05.10

Abstract

We have developed a compact and cost-effective camera module on the basis of wafer-scale replication technology. A multiple-layered structure of several aspheric lenses in a mobile camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. We have demonstrated a VGA camera module fabricated by the wafer-scale replication processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having 200 um sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in order to achieve a higher resolution in wafer-scaled lenses for mobile camera modules.

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