한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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- Pages.75-91
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- 2006
Super Chip Integration Based on Chip-to-Wafer 3D Integration Technology
- Tanaka, Tetsu (Department of Bioenginerring and Robotics, Graduate School of Engineering, Tohoku Univ.) ;
- Fukushima, T. (Department of Bioenginerring and Robotics, Graduate School of Engineering, Tohoku Univ.) ;
- Koyanagi, M. (Department of Bioenginerring and Robotics, Graduate School of Engineering, Tohoku Univ.)
- 발행 : 2006.10.11