Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 2005.11a
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- Pages.603-606
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- 2005
The Study of Ni-Pd Alloy Characteristics to Form a NiSi for Shallow S/D Junction
Shallow S/D Junction에 적용 가능한 NiSi를 형성하기 위한 Ni-Pd 합금의 특성 연구
- Lee, Won-Jae (Dept. of Electronics Engineering, Chungnam National University) ;
- Oh, Soon-Young (Dept. of Electronics Engineering, Chungnam National University) ;
- Agchbayar, Tuya (Dept. of Electronics Engineering, Chungnam National University) ;
- Yun, Jang-Gn (Dept. of Electronics Engineering, Chungnam National University) ;
- Kim, Yong-Jin (Dept. of Electronics Engineering, Chungnam National University) ;
- Zhang, Ying-Ying (Dept. of Electronics Engineering, Chungnam National University) ;
- Zhong, Zhun (Dept. of Electronics Engineering, Chungnam National University) ;
- Kim, Do-Woo (Dept. of Electronics Engineering, Chungnam National University) ;
- Cha, Han-Seob (R&D Division, MagnaChip Semiconductor) ;
- Heo, Sang-Bum (R&D Division, MagnaChip Semiconductor) ;
- Wang, Jin-Suk (Dept. of Electronics Engineering, Chungnam National University) ;
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Lee, Hi-Deok
(Dept. of Electronics Engineering, Chungnam National University)
- 이원재 (충남대학교 전자공학과) ;
- 오순영 (충남대학교 전자공학과) ;
- 아그츠바야르투야 (충남대학교 전자공학과) ;
- 윤장근 (충남대학교 전자공학과) ;
- 김용진 (충남대학교 전자공학과) ;
- 장잉잉 (충남대학교 전자공학과) ;
- 종준 (충남대학교 전자공학과) ;
- 김도우 (충남대학교 전자공학과) ;
- 차한섭 (매그너칩반도체 연구소) ;
- 허상범 (매그너칩반도체 연구소) ;
- 왕진석 (충남대학교 전자공학과) ;
-
이희덕
(충남대학교 전자공학과)
- Published : 2005.11.26
Abstract
In this paper, the formation and thermal stability of Ni-silicide using Ni-Pd alloys is studied for ultra shallow S/D junction of nano-scale CMOSFETs. There are no different effects when Ni-Pd is used in single structure and TiN capping structure. But, in case of Cobalt interlayer structure, it was found that Pure Ni had lower sheet resistance than Ni-Pd, because of a thick silicide. Also, Ni-Pd has merits that surface of silicide and interface between silicide and silicon have a good morphology characteristics. As a result, Ni-Pd is an optimal candidate for shallow S/D junction when cobalt is used for thermal stability.
Keywords