Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 2005.06a
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- Pages.1140-1144
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- 2005
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- 2005-8446(pISSN)
Fabrication of plastic CE (capillary electrophoresis) microchip by hot embossing process
핫 엠보싱 공정을 이용한 플라스틱 CE(capillary electrophoresis) 마이크로 칩의 제작
- Cha Nam-Goo (MicroBioChip Center, Hanyang Univ.) ;
- Park Chang-Hwa (MicroBioChip Center, Hanyang Univ.) ;
- Lim Hyun-Woo (MicroBioChip Center, Hanyang Univ.) ;
- Park Jin-Goo (MicroBioChip Center, Hanyang Univ.)
- Published : 2005.06.01
Abstract
A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.
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