• Title/Summary/Keyword: 핫 엠보싱

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핫 엠보싱을 이용한 3차원 미세 구조물 복제에 관한 연구

  • 박선준;정성일;정해도
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.150-150
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    • 2004
  • 현재의 핫 엠보싱 기술은 나노/마이크로 패턴의 복제 기술로 다방면에서 연구되어지고 있다. 기존에 알려진 핫 엠보싱 기술은 하드 몰드를 사용하여 열과 압력을 가해서 PR 패턴 제작이나 나노/마이크로 구조물을 제작하였다. 그러나 이러한 하드 몰드의 사용은 3차원 구조물을 구현할 수 없다는 단점이 있다. 이에 본 연구에서는 하드 몰드 대신 소프트 몰드를 사용하여 3차원 미세 구조물을 구현해 보고자 한다.(중략)

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Fabrication of plastic CE (capillary electrophoresis) microchip by hot embossing process (핫 엠보싱 공정을 이용한 플라스틱 CE(capillary electrophoresis) 마이크로 칩의 제작)

  • Cha Nam-Goo;Park Chang-Hwa;Lim Hyun-Woo;Park Jin-Goo
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1140-1144
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    • 2005
  • A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

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The effect of melt flow index on polymer deformation in hot embossing process (고분자 분자량 변화에 따른 핫 엠보싱 공정 연구)

  • Yoon, Keun-Byoung;Jeong, Myung-Young
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.1025-1029
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    • 2003
  • We studied the cross-sectional profiles of deformed thermoplastics in hot embossing process and compared with melt flow index for various embossing conditions such as embossing temperature, embossing pressure and initial thickness of the thermoplastics. The fastest embossing times for complete penetration of the cavities were obtained at temperature greater than $60^{\circ}C$ above glass transition temperature (Tg). When the melt flow index of polymer is low, the penetration ratio does not become large even if the embossing pressure increases. The complete occupation of the cavities was easier obtained with high melt flow index polymer than low melt flow index polymer at the same process condition. We believe these results can be very useful for optimizing nanostructured hot embossing also known nanoimprinting process conditions.

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Development of a Hot-Embossing Process using Ceramic Glass Molds for Polymer Micro Structures (글라스 주형을 이용한 폴리머 미세 형상 핫-엠보싱 공정 연구)

  • Kim, Joo-Han;Shin, Ki-Hoon
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.6
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    • pp.168-174
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    • 2007
  • A ceramic glass mold was developed for micro hot-embossing and replicated polymer parts are fabricated. The glass-ceramic micro mold could be fabricated with a laser process and a wet etching process and the fabrication time could be saved a lot. Various polymer micro structures can be obtained by hot-embossing. The process parameters such as ho-embossing temperatures or pressures were investigated and optimized. This process can be applied for fabrication of micro structures for flip-chips or micro fluidic channels for bio-engineering. The advantages and disadvantages of this process are discussed, too.

Study on Fabrication of Highly Ordered Nano Patterned Master by Using Anodic Aluminum Oxidation (AAO를 이용한 나노 패턴 마스터 제작에 관한 연구)

  • Shin, H.G.;Kwon, J.T.;Seo, Y.H.;Kim, B.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2007.05a
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    • pp.368-370
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    • 2007
  • AAO(Anodic Aluminum Oxidation) method has been known that it is practically useful for the fabrication of nano-structures and makes it possible to fabricate the highly ordered nano masters on large surface and even on the 2.5 or 3D surface at low cost comparing to the expensive e-beam lithography or the conventional silicon processing. In this study, by using the multi-step anodizing and etching processes, highly ordered nano patterned master with concave shapes was fabricated. By varying the processing parameters, such as initial matter and chemical conditions; electrical and thermal conditions; time scheduling; and so on, the size and the pitch of the nano pattern can be controlled. Consequently, various alumina/aluminum nano structures can be easily available in any size and shape by optimized anodic oxidation in various aqueous acids. The resulting good filled uniform nano molded structure through hot embossing molding process shows the validity of the fabricated nano pattern masters.

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Quantitative rheology of polymers in high resolution structuring (미세성형공정에서의 폴리머 레올로지의 정량화)

  • Kim, Byeong-Hee;Kim, Heon-Young;Ki, Ho;Kim, Kwang-Soon;Kang, Shin-Ill
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.1036-1042
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    • 2003
  • The hot embossing process has been mentioned as one of major nanoreplication techniques. This is due to its simple process, low cost, high replication fidelity and relatively high throughput. As the initial step of quantitating the embossing process , simple parametric study about embossing time have been carried out using high-resolution masters which patterned by the DRIE process and laser machining. Under the various embossing time, the viscous flow of thin PMMA films into microcavities during compression force has been investigated. Also, a study about simulating the viscous flow during embossing process has planned and continuum scale FDM analysis was applied on this simulation. With currently available test data and condition, simple FDM analysis using FLOW3D was made attempt to match simulation and experiment.

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Fabrication of Ni master for the replication of planar optical devices by LIGA process (LIGA 공정을 이용한 평면형 광소자용 Ni 마스터 제작)

  • Kim, Jin-Tae;Jeong, Myung-Yung
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.945-949
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    • 2003
  • LIGA(Lithographie Galvanoformung Abformung), a fabrication method for the production of microstructrues with a high aspect ratio, is now playing an important role in a fabrication of polymeric optical waveguide device as the replication processes have been developed such as hot embossing and injection molding. The present report deals with the fabrication of Ni master used for the replication of multi-mode polymeric optical waveguide. With the basic technological features in the sequence of the LIGA technique, we fabricated Ni master with 12 channel microstructures of $100\;{\times}\;100{\mu}m\;^2{\times}\;60mm$, and achieved an accuracy of ${\pm}1\;{\mu}m$. Manufactured polymeric optical wavegude with the same using hot embossing process has also the same accuracy and approved its mass production capability.

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