반도체 장비용 고속프레스의 동특성 해석에 관한 연구

High speed presses with high resolution in semiconductor lead frame manufacturing process are needed . But high speed operation accompanies mechanical vibration. therefore optimized kinematic structure to minimize vibration is required for a high speed press. And the growing competition in the industry asks a press with low cost, high speed, high resolution, and high pressing force, For this purpose a high speed press was modeled with 3D CAD solid modeling system and dynamic analysis were performed with CAE S/W for multibody dynamic analysis, Through these analyses a motor appropriate to a high speed press was selected and link structure for feeding system of the press was modified to reduce vibration. To perform this analysis working Model which is 2D kinematics and dynamic analysis software was used.