Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.11a
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- Pages.20-20
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- 2004
(Via Filling for SIP by Using ionized Metal Plasma PVD and Electroplating)
IMP PVD 및 전기도금을 이용한 SIP용 Via Filling에 대한 연구
Abstract
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