한국정밀공학회:학술대회논문집 (Proceedings of the Korean Society of Precision Engineering Conference)
- 한국정밀공학회 2003년도 춘계학술대회 논문집
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- Pages.82-85
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- 2003
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- 2005-8446(pISSN)
광반도체용 사파이어웨이퍼 기계연마특성 연구
A Study on the Micro-lapping process of Sapphire Wafers for optoelectronic devices
초록
The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by Micro-lapping process. The sapphire crystalline wafers were characterized by DCXD(Double Crystal X-ray Diffraction). The sample quality of crystalline sapphire wafer at surface has a FWHM(Full Width at Half Maximum) of 250 arcsec. This value at the sapphire wafer surfaces indicated 0.12
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