한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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- Pages.247-250
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- 2003
고분자 층에서 발생하는 균열 해석
Analysis of Crack Induced in Polymeric Layer
초록
In this paper, the boundary element analysis of viscoelastic strain energy release ,ate G(t) for the cracked linear viscoelastic materials is attempted. This study proposes the G(t) equation and the calculating method of G(t) by time-domain boundary element analysis for the viscoelastic solids. The G(t) is defined as the derivative of the viscoelastic potential energy
키워드