한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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미세피치 Sn-In 솔더범프를 이용한 COG(Chip on Glass) 본딩공정 및 전기적 특성

Processing and Electrical Properties of COG(Chip on Glass) Bonding Using Fine-pitch Sn-In Solder Bumps

  • 최재훈 (홍익대학교 금속재료공학과) ;
  • 전성우 (홍익대학교 금속재료공학과) ;
  • 정부양 (홍익대학교 금속재료공학과) ;
  • 오태성 (홍익대학교 금속재료공학과) ;
  • 김영호 (한양대학교 재료공학부)
  • 발행 : 2003.11.01
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초록

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

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