한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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- Pages.103-105
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- 2003
미세피치 Sn-In 솔더범프를 이용한 COG(Chip on Glass) 본딩공정 및 전기적 특성
Processing and Electrical Properties of COG(Chip on Glass) Bonding Using Fine-pitch Sn-In Solder Bumps
초록
COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of
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