한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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- Pages.12-12
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- 2003
EMC 특성이 Package warpage 거동에 미치는 영향
Effect of EMC Characteristics on Package Warpage Behavior
- SONG Jae-kyu (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.) ;
- YOO Min (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.) ;
- YOO HeeYeoul (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.)
- 발행 : 2003.11.01