한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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- Pages.342-345
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- 2002
후막 리소그라피 공정을 이용한 내장형 캐패시터 개발에 관한 연구
The Study on the embedded capacitor using thick film lithography
- Yoo, Chan-Sei (Korea Electronics Technology Institute(KETI)) ;
- Park, Seong-Dae (Korea Electronics Technology Institute(KETI)) ;
- Park, Jong-Chul (Korea Electronics Technology Institute(KETI))
- 발행 : 2002.11.07
초록
As the size of chip components and module decreases, new patteming method for fine line and geometry is needed. So far, in LTCC(Low Temperature Cofired Ceramic) process, screen printing method has been used generally. But screen printing method has some disadvantages as follows. First, the geometry including line, vias, etc. smaller than