한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2002년도 International Symposium
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- Pages.249-252
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- 2002
Next Generation Electronic Packaging and Bumpless Interconnection
- Tadaotomo Suga (The University of Tokyo, Research Center for Science and Technology) ;
- Toshihiro Itoh (The University of Tokyo, Research Center for Science and Technology) ;
- Akitsu Shigetou (The University of Tokyo, Research Center for Science and Technology)
- 발행 : 2002.09.01