한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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- Pages.87-119
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- 2001
Printed Circuit Board Technology Roadmap 2001 in Japan
초록
Fine Pitch Technology will be accelerated among next decade. Buildup Technology is Key Technology for High Density Interconnection. Novel Base Material is critical for High Speed, Area Array Flip Chip Application. Japanese PWB Technology Roadmap will be Published soon.
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