Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2001.11a
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- Pages.115-118
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- 2001
Solder Bump Formation for Flip Chip Application Using Stencil Printing
스텐실 프린팅을 이용한 플립칩용 솔더범프 형성공정
Abstract
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