한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2001년도 추계학술대회 논문집
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- Pages.332-336
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- 2001
광패키징용 마이크로 솔더범프의 형성과 Contact Pad용 UBM간의 계면 반응 특성에 관한 연구
A Study on Bumping of Micro-Solder for Optical Packaging and Reaction at Solder/UBM interface
초록
In this study, the reaction at UBM(Under Bump Metallurgy) and solder interface was investigated. The UBM employed in conventional optical packages, Au/Pt/Ti layer, were found to dissolve into molten Au-Sn eutectic solder during reflow soldering. Therefore, the reaction with different diffusion barrier layer such as Fe, Co, Ni were investigated to replace the conventional R layer. The reaction behavior was investigated by reflowing the solder on the pad of the metals defined by Cr layer for 1, 2, 3, 4, and 5 minutes at 330