Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 2001.04a
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- Pages.566-569
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- 2001
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- 2005-8446(pISSN)
Reliability Evaluation System of Hot Plate for PR Baking
Hot Plate 신뢰성 시험.평가장비 개발
Abstract
Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist(PR) and to bake coated PR in FAB process of semiconductor. It is necessary to guarantee the performance of Hot Plate(HP). Therefore, in this study designed and developed the reliability system of HP to measure and estimated thermal uniformity and flatness in temperature setting amplitude
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