대한기계학회:학술대회논문집 (Proceedings of the KSME Conference)
- 대한기계학회 2000년도 추계학술대회논문집A
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- Pages.292-297
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- 2000
이종재료의 진전 계면 균열에 대한 동적 광탄성 실험법
Dynamic Photoelastic Experimental Method for Propagating Interfacial Crack of Bimaterials
초록
In this research, the dynamic photoelastic experimental hybrid method for bimaterial is introduced. Dynamic biaxial loading device is developed, its strain rate is 31.637 s-1 and its maximum impact load is 20 ton. Manufactured methods for model of the dynamic photoelastic experiment for bimaterial are suggested. They are bonding method(bonding material: AW106, PC-1) and molding method. In the bonding method, residual stress is not occurred in the manufactured bimaterial. Crack is propagated along the interface or sometimes deviated from the interface. While in the molding method, residual stress is occurred in the manufactured bimaterial. Crack is always deviated from the interface and propagated in the epoxy region(softer materila). In order to propagate with constant velocity along the interface of bimaterial with arbitrary stiffer material, edge crack should be located along the interface of the acute angle side of the softer material in the bimaterial.
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