한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2000년도 추계 기술심포지움 논문집
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- Pages.3-8
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- 2000
Package Design for Protecting Active Chip Surface from Damage due to a Dicing Saw Blade
- Lee, Seong-Min (Department of Materials Science & Engineering University of Inchon)
- 발행 : 2000.11.01