대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)
- 대한전자공학회 1999년도 하계종합학술대회 논문집
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- Pages.389-392
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- 1999
그라운드 평면을 갖는 다층 구조 IC 패키지 시스템에서 동시 스위칭 노이즈 모델링
Simultaneous Switching Noise Model in Multi-Layered IC Package System with Ground Plane
초록
It is essential to estimate an effective inductance in a ground plane of muliti-layer IC package system in order to determine the simultaneous switching noise of the package. A new method to estimate the effective ground inductance in multi-layer IC package is presented. With the estimated ground plane inductance values, maximum switching noise variations according to the number of simultaneously switching drivers are investigated by developing a new SSN model. These results are verified by performing HSPICE simulation with the 0.35
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