한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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- Pages.103-106
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- 1999
Field Emission Display의 고진공 실장에 관한 연구
Study on Vacuum Packaging of Field Emission Display
- Lee, Duck-Jung (KIST) ;
-
Ju, Byeong-Kwon
(KIST) ;
-
Jang, Jin
;
- Oh, Myong-Hwan (KIST)
- 발행 : 1999.05.01
초록
In this paper, we suggest the FED packaging technology that have 4mm thickness, using sodalime glass-to-sodalime glass electrostatic bonding. It based on conventional silicon-glass bonding. The silicon film was deposited an around the exhausting hole on FED backside panel. And then, the silicon film of panel was successfully bonded with capping(bare) glass in vacuum environment and the FED panel was vacuum-sealed. In this method, we could achieve more 153 times increased conductance and 200 times increased vacuum efficiency than conventional tube packaging method. The vacuum level in panel, by SRG test, was maintained about low 10