복잡한다 층구조 IC 패키지의 회로 모델링 및 스위칭 노이즈 분석

A Simplified Circuit Model and Switching Noise Characterization of the Complicated Multi-Layer IC Package

A new simplified circuit model for the switching noise analysis of the complicated multi-layer IC package is developed. The current flowing mechanism on the ground and power planes of the package is simplified by using the dependent current soures and partial plane circuit model. The methodology is very cost-efficient as well as accurate. It is demonstrated that the nosie based on the simplified circuit model has an excellent agreement with that of the complicated full circuit model. However, the simplified model takes only 5 minutes for the switching noise simulation, while the full circuit model takes more than 4 hours.