Poly-Si의 성장 기구와 제특성

the Deposition Mechanism & Characteristics for the Poly-Si Film

  • 발행 : 1991.07.18

초록

the poly silicon film was deposited by APCVD. and then the deposition mechanism and electrical characteristics was investigated for that film. The grain phase, the deposition rate, and the etch characteristics were evaluated according to the deposition conditions. The criteria temperature of surface morphology state was $730^{\circ}C {\sim}780^{\circ}C$ between the mirror phase grain and the powder phase grain.

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