• Steel and Composite Structures
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• 제7권3호
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• pp.253-262
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• 2007

A methodology to design symmetrically laminated fibre-reinforced structures under transverse loads for minimum weight, with manufacturing uncertainty in the ply angle, is described. The ply angle and the ply thickness are the design variables, and the Tsai-Wu failure criteria is the design constraint implemented. It is assumed that the probability of any tolerance value occurring within the tolerance band, compared with any other, is equal, and thus the approach is a worst-case scenario approach. The finite element method, based on Mindlin plate and shell theory, is implemented, and thus effects like bending-twisting coupling are accounted for. The Golden Section method is used as the search algorithm, but the methodology is flexible enough to allow any appropriate finite element formulation, search algorithm and failure criterion to be substituted. In order to demonstrate the procedure, laminated plates with varying aspect ratios and boundary conditions are optimally designed and compared.

• 한국음향학회지
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• 제5권1호
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• pp.24-34
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• 1986

Recently, as the noise problems of mechancial structures have been more serious, much studies are being carried out on the identification of noise sources and the reduction of noise level. In this paper, as the application of frequency analysis, the multi-dimensional spectral analysis method is applied to daisy wheel printer to identify the noise sources, and the relationship between sound pressure and vibration of printer is found in narrow and overall frequency range. The results of this study are compared with those of frequency response function method, thus, the applicability of multidimensional spectral analysis method is verified. It can be found, in a overall frequency range, that the vibration of platen have the worst effect on noise level, and the noise level reduction of 6dB, 7.9dB is obtained by changing the platen thickness to 2mm, 4mm, respectively.

• Asian-Australasian Journal of Animal Sciences
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• 제28권3호
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• pp.442-450
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• 2015

Climate temperature affects animal production. This study was conducted to evaluate whether climatic conditions affect beef carcass characteristics of Korean cattle steers. The monthly carcass characteristics of Korean cattle steers (n = 2,182,415) for 8 yr (2006 through 2013) were collected from the Korean Institute for Animal Products Quality Evaluation. Daily climate temperature (CT) and relative humidity (RH) data were collected from the Korean Meteorological Administration. Weather conditions in South Korea during summer were hot and humid, with a maximum temperature of $28.4^{\circ}C$ and a maximum RH of 91.4%. The temperature-humidity index (THI), calculated based on CT and RH, ranges from 73 to 80 during summer. Winter in South Korea was cold, with a minimum temperature of $-4.0^{\circ}C$ and a wind-chill temperature of $-6.2^{\circ}C$. Both marbling score (MS) and quality grade (QG) of Korean cattle steer carcasses were generally best (p<0.05) in autumn and worst in spring. A correlation analysis showed that MS and QG frequencies were not associated (p>0.05) with CT. Yield grade (YG) of Korean cattle steer carcasses was lowest (p<0.05) in winter (November to January) and highest in spring and summer (May to September). A correlation analysis revealed that YG frequency was strongly correlated ($r{\geq}0.71$; p<0.01) with CT and THI values. The rib eye area, a positive YG parameter, was not associated with CT. Backfat thickness (BT), a negative YG factor, was highest in winter (November and December). The BT was strongly negatively correlated ($r{\leq}-0.74$; p<0.01) with CTs. Therefore, the poor YG during winter is likely due in part to the high BT. In conclusion, YG in Korean cattle steer carcasses was worst in winter. QGs were not associated with winter or summer climatic conditions.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.375-375
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• 2010

CdTe as an absorber material is widely used in thin film solar cells with the heterostructure due to its almost ideal band gap energy of 1.45 eV, high photovoltaic conversion efficiency, low cost and stable performance. The deposition methods and preparation conditions for the fabrication of CdTe are very important for the achievement of high solar cell conversion efficiency. There are some rearranged reports about the deposition methods available for the preparation of CdTe thin films such as close spaced sublimation (CSS), physical vapor deposition (PVD), vacuum evaporation, vapor transport deposition (VTD), closed space vapor transport, electrodeposition, screen printing, spray pyrolysis, metalorganic chemical vapor deposition (MOCVD), and RF sputtering. The RF sputtering method for the preparation of CdTe thin films has important advantages in that the thin films can be prepared at low growth temperatures with large-area deposition suitable for mass-production. The authors reported that the optical and electrical properties of CdTe thin film were closely connected by the thickness-uniformity of the film in the previous study [1], which means that the better optical absorbance and the higher carrier concentration could be obtained in the better condition of thickness-uniformity for CdTe thin film. The thickness-uniformity could be controlled and improved by the some process parameters such as vacuum level and RF power in the sputtering process of CdTe thin films. However, there is a limitation to improve the thickness-uniformity only in the preparation process [1]. So it is necessary to introduce the external or additional method for improving the thickness-uniformity of CdTe thin film because the cell size of thin film solar cell will be enlarged. Therefore, the authors firstly applied the chemical mechanical polishing (CMP) process to improving the thickness-uniformity of CdTe thin films with a G&P POLI-450 CMP polisher [2]. CMP process is the most important process in semiconductor manufacturing processes in order to planarize the surface of the wafer even over 300 mm and to form the copper interconnects with damascene process. Some important CMP characteristics for CdTe were obtained including removal rate (RR), WIWNU%, RMS roughness, and peak-to-valley roughness [2]. With these important results, the CMP process for CdTe thin films was performed to improve the thickness-uniformity of the sputtering-deposited CdTe thin film which had the worst two thickness-uniformities of them. Some optical properties including optical transmittance and absorbance of the CdTe thin films were measured by using a UV-Visible spectrophotometer (Varian Techtron, Cary500scan) in the range of 400 - 800 nm. After CMP process, the thickness-uniformities became better than that of the best condition in the previous sputtering process of CdTe thin films. Consequently, the optical properties were directly affected by the thickness-uniformity of CdTe thin film. The absorbance of CdTe thin films was improved although the thickness of CdTe thin film was not changed.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권5호
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• pp.649-657
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• 2014

In this study, the effects of the frequency-dependent characteristics of through-silicon vias (TSVs) on the performance of 3D ICs are examined by evaluating a typical interconnection structure, which is composed of 32-nm CMOS inverter drivers and receivers connected through TSVs. The frequency-domain model of TSVs is extracted in S-parameter from a 3D electromagnetic (EM) method, where the dimensional variation effect of TSVs can be accurately considered for a comprehensive parameter sweep simulation. A parametric analysis shows that the propagation delay increases with the diameter and height of the TSVs but decreases with the pitch and liner thickness. We also investigate the crosstalk effect between TSVs by testing different signaling conditions. From the simulations, the worst signal integrity is observed when the signal experiences a simultaneously coupled transition in the opposite direction from the aggressor lines. Simulation results for nine-TSV bundles having regular and staggered patterns reveal that the proposed method can characterize TSV-based 3D interconnections of any dimensions and patterns.

• Journal of Electrical Engineering and Technology
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• 제9권6호
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• pp.2154-2161
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• 2014

Growth analysis and selection of sea cucumbers (Stichopus japonicas) is typically performed through length or weight measurements. However, because sea cucumbers continuously change shape depending on the external environment, weight measurement has been the preferred approach. Weight measurements require extensive time and labor, moreover it is often difficult to accurately weigh sea cucumbers because of their wet surface. The present study measured sea cucumber features, including the body length, width, and thickness, by using a vision system and regression analysis to generate $R^2$ values that were used to develop a weight estimation algorithm. The $R^2$ value between the actual volume and weight of the sea cucumbers was 0.999, which was relatively high. Evaluation of the performance of this algorithm using cross-validation showed that the root mean square error and worst-case prediction error were 1.434 g and ${\pm}5.879g$, respectively. In addition, the present study confirmed that the proposed weight estimation algorithm and single slide rail device for weight measurement can measure weights at approximately 4,500 sea cucumbers per hour.

• 한국생산제조학회지
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• 제24권2호
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• pp.224-230
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• 2015

In this study, the machinability of sapphire glass is tested using the powder blasting method under various blasting conditions. The thickness and diameter of the sapphire glass samples were 0.4 mm and 50.8 mm (2 inch), respectively. The machined patterns from each sample were a circle, a square, and a rectangle. The powder we used was GC #400 and #800. The blasting pressures of the powders were 2, 4, and 6 bar. The scanning time of the nozzle was 20 and the scanning speeds of the nozzle were 80, 100, and 120 mm/s. Experimental results showed that machining depths increased in proportion to blasting pressure. The machining depth of GC #800 was much higher than that of GC #400, while surface roughness was worst with GC #400. These results imply that the blasting pressure and size of the blasting powder are the most important parameters for machining sapphire glass.

• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.42-48
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• 2020

As global warming accelerates, eco-friendly electric cars are being developed to reduce carbon dioxide emissions, and power conversion inverters are used to drive motors. Among inverter components, DC-link capacitor is heated by high current usage, which causes problems such as performance and life-saving of inverter. Although metal cases with good thermal performance have been used to solve this problem, it is difficult to apply them in practice due to insulation problems with other parts. In this paper, the Heat-Generation influence factor of DC-link capacitor is analyzed. Variables on heat-generation are set at 3 levels for film width, inductance, and film thickness. Box-Behnken to 13 tests using the design and minimal deviations, e.g. through the experiment three times by each level. The surface of the film k type by attaching the sensor current is measured temperature. Capacitance was set to a minimum level of 200 ㎌ and had a frequency of 16 kHz with Worst case, ambient temperature of 85℃ and a ripple current of 50 Ams was applied. The temperature at the measurement point was collected in the data logger after sampling at 1 minute intervals for 2 hours after saturation with the ambient temperature. This experiment confirmed that setup factors are correlated with heat-generation.

• Journal of Welding and Joining
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• 제23권4호
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• pp.59-65
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• 2005

The resistance spot welding is one of the most commonly used welding process for joining the sheet metal in automotive manufacturing process due to higher deposition rates and higher economy achieved. Control variables in the resistance spot welding for achieving high quality are welding current, welding force and welding time. Generally at the manufacturing scene, welding current Vs welding time lobe diagram is used to estimate weldability because controlling welding force is not practical due to economical reasons. However new automotive steel plates have been developed to make lightweight automobiles and to improve resistance against rusting. Also the weldability of these steel plates are worst than the existing steel plates because of changing bare metal and surface plating effect. In consequence of above mentioned reasons, it is necessary to use welding force to present the lobe diagram. In this study, we obtained the welding force Vs welding current lobe diagram for commonly used GA steel plate and found that the second order repression model of tensile shear strength was useful in reducing the number of experiments, and the indentation, and thickness change during welding were used as a response to estimate quantitatively expulsion.

• E2M - 전기 전자와 첨단 소재
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• 제7권5호
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• pp.376-382
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• 1994

In this study we developed a program(DEVSIM) to simulate the two dimensional distribution of the electrostatic potential and the electric field of the arbitrary structure consisting of GaAs/AlGaAs semiconductor and metal as well as dielectric. By the comparision of the electric field distribution of GaAs MESFETs with the various recess gates we proposed a suitable device structure to improve the breakdown characteristics of MESFET. According to the results of simulation the breakdown characteristics were improved as the thickness of the active epitaxial layer was decreased. And the planar structure, which had the highly doped layer under the drain for the ohmic contact, was the worst because the highly doped layer prevented the space charge layer below the gate from extending to the drain, which produced the narrow spaced distribution of the electrostatic potential contours resulting in the high electric field near the drain end. Instead of the planar structure with the highly doped drain the recess gate structure having the highly doped epitaxial drain layer show the better breakdown characteristics by allowing the extention of the space charge layer to the drain. Especially, the structure in which the part of the drain epitaxial layer near the gate show the more improvement of the breakdown characteristics.