• Journal of the Korea Institute of Military Science and Technology
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• v.13 no.1
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• pp.57-66
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• 2010

This work describes an applications of CEP(Capability Evolution Process) in the SoS(Systems of Systems) environment. SoS is a set of systems that results when independent systems are integrated into a larger systems that delivers unique capability. CEP is focused on system performance and integration, interoperability requirement between systems within a force package. This work analyzes CEP and applies to OO joint marinetime operation. From these results, the possiblity of the CEP application in the SoS environment is presented.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.9
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• pp.117-122
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• 1999

Track rubber parts has heat built-up as long as dynamic loading is applied from running tracked vehicles. Durability is required for rubber part to sustain the heat accumulation and heat exchange between rubber-metal assembly and environmental air and ground. For this research, the track assembly was divided into four parts i.e., bottom track shoe, upper track pad, pin busing and metal structure. Three rubber parts and metal structure were modelled and analyzed with MARC package program to obtain time-temperature data which was induced form mechanical work of tracked vehicles. heat accumulation data was obtained from special experiments under the room temperature of 25$^{\circ}C\;and\;35^{\circ}C$ to simulate the actual environmental conditions. From this research, it is cleared that the environmental temperature does not affect to the heat accumulation speed in rubber parts. Also, the heat built-up mechanism was clarified from the thermo-mechanical work based on numerical analysis and experiments.

• Korean Journal of Construction Engineering and Management
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• v.20 no.2
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• pp.95-104
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• 2019

EPC plant projects are large and complex, requiring systematic working methodologies, accumulated data, and thorough planning through communications between the entities. In this study, the method of extracting the process planning information using asset data of the plant project and using it to present the initial process plan is presented through the concept of IAP(Interactive Planning). In order to carry out the effective IAP at the early stage of the project, this study extracted the schedule element information from the asset data, created the process plan for each work package, and applied it to the sample project case. Through the proposed IAP methodology, it is possible to promote the utilization of asset data, to identify schedule risks, and to develop countermeasures, which can form the basis for establishing the process management strategy to successfully complete the project.

• The Journal of the Korea Contents Association
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• v.6 no.2
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• pp.17-26
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• 2006

SIP(Session Initiation Protocol)-based centralized conference service model has advantage of easiness in conference management and service as compared to other models. However when media server which is one of the components of conference server is included in the conference server, this model shows disadvantage of high server work load with increasing numbers of conferences and participants. In this paper, to improve this problem, we have suggested and implemented a new conference service model in which an UA(User Agent) who first make the conference acts as a media server instead of conventional conference server and, the conference server with conference event package takes only part of management of the conference and its participants. Therefore, many more conferences can be held and managed compared to the conventional centralized conference service model because load of the conference server decreases in our suggested model md, furthermore the participants needs only make SIP call connections to the UA who first make the conference for establishing media session.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.857-863
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• 2014

In this work, we introduce various bonding technologies for 3D package and suggest Insert-Bump bonding (ISB) process newly to stack multi-layer chips successively. Microstructure of Insert-Bump bonding (ISB) specimens is investigated with respect to bonding parameters. Through experiments, we study on find optimal bonding conditions such as bonding temperature and bonding pressure and also evaluate in the case of fluxing and no-fluxing condition. Although no-fluxing bonding process is applied to ISB bonding process, good bonding interface at $270^{\circ}C$ is formed due to the effect of oxide layer breakage.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.30-32
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• 2005

This paper reports on an LTCC-based packaging method using Au/Sn eutectic bonding process for RF MEMS applications. The proposed packaging structure was realized by a micromachining technology. An LTCC substrate consists of metal filled vertical via feedthroughs for electrical interconnection and Au/Sn sealing rim for eutectic bonding. The LTCC capping substrate and the glass bottom substrate were aligned and bonded together by a flip-chip bonding technology. From now on, shear strength and He leak rate will be measured then the fabricated package will be compared with the LTCC package using BCB adhesive bonding method which has been researched in our previous work.

• Journal of Korea Multimedia Society
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• v.19 no.4
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• pp.747-755
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• 2016

Automated guided vehicles have been used for a long time to increase work efficiency in the logistics field, but it is difficult to apply to a variety of logistics sites due to either the restricted movement mechanism or expensive devices. In this paper, we present a flexible software architecture that is hardware-independent for a mobile power cart of the follow mode and implement it using a ROS software platform. Through the SCV analysis for the system functionalities, we design a package to track a user movement and a package to control a new hardware platform. It has an advantage to use a variety of movement algorithms and hardware platforms by applying the strategy pattern and the template method pattern for the design of a software architecture. Through the performance evaluation, we show that the proposed design is maintainable in terms of a software complexity and it detects a user's movement by obtaining a user skeleton information so that it can control a hardware platform to move at a certain distance.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.609-613
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• 2005

Advanced mobile communication devices require a bright, high information content display in a small, light-weight, low power consumption package. In this paper we will outline our progress towards developing such a low power consumption active-matrix flexible OLED ($FOLED^{TM}$) display. Our work in this area is focused on three critical enabling technologies. The first is the development of a high efficiency long-lived phosphorescent OLED ($PHOLED{TM}$) device technology, which has now proven itself to be capable of meeting the low power consumption performance requirements for mobile display applications. Secondly, is the development of flexible active matrix backplanes, and for this our team are employing poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier. Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing. We also present progress in operational lifetime of encapsulated T-PHOLED pixels on planarized metal foil and discuss PHOLED encapsulation strategy.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• ETRI Journal
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• v.35 no.2
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• pp.245-252
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• 2013

In this work, we study the physical layer solutions for 10-gigabit-capable passive optical networks (PONs), particularly for an optical link terminal (OLT) including a 10-Gbit/s electroabsorption modulated laser (EML) and a 2.5-Gbit/s burst mode receiver (BM-Rx) in a novel bidirectional optical subassembly (BOSA). As unique features, a bidirectional mini-flat package and a 9-pin TO package are developed for a 10-gigabit-capable PON OLT BOSA composed of a 1,577-nm EML and a 1,270-nm avalanche photodiode BM-Rx, including a single-chip burst mode integrated circuit that is integrated with a transimpedance and limiting amplifier. In the developed prototype, the 10-Gbit/s transmitter and 2.5-Gbit/s receiver characteristics are evaluated and compared with the physical media dependent (PMD) specifications in ITU-T G.987.2 for XG-PON1. By conducting the 10-Gbit/s downstream and 2.5-Gbit/s upstream transmission experiments, we verify that the developed 10-gigabitcapable PON PMD prototype can operate for extended network coverage of up to a 40-km fiber reach.