• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.7-12
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• 2012

Sn whiskers are a serious cause of failure in electronic devices as they create short circuits. Sn whisker growth and mitigation have been investigated by many Japanese consortia including JEITA and JAXA. This paper gives an overview about recent researches of JEITA and JAXA.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1998.10a
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• pp.25-29
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• 1998

Sliding wear test and surface characterization techniques such as micro-Raman spectroscopy were employed to determine the effect of whisker content and orientation on the friction and wear behavior of SiC whisker reinforced alumina. Composites containing unidirectionally oriented whiskers were fabricated by novel technique Addition of SiC whiskers up to 20 vol.% lowered the friction and improved wear resistance. The results of this study indicated that highly disordered graphite and size of the layer behind the whiskers were responsible for variation of wear rate and friction coefficient.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.1061-1062
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• 2008

Rodents demonstrate an outstanding capability for tactile perceptions using their whiskers. The mechanoreceptors in the whisker follicles are responsive to the deflections or vibrations of the whisker beams. It is believed that the sensor processing can determine the location of an object in touch, that is, the angular position and direction of the object. We designed artificial whiskers modelling the real whiskers and tested tactile localization. The robotic system needs to adjust its position against an object to help the shape recognition. We show a robotic adjustment of position based on tactile localization. The behaviour uses deflection curves of the whisker sensors for every sweep of whiskers and estimates the location of a target object.

• Journal of the Korean Ceramic Society
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• v.39 no.8
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• pp.715-720
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• 2002

Silicon nitride samples with aligned whisker seeds were prepared with different amounts of yttria and alumina as the sintering additives. Their sintering behaviors and the microstructural developments between 2123K and 2323K were examined. The sample with larger amount of the sintering additives showed faster densification and grain growth. Even though addition of the aligned whisker seeds slightly retarded densification of silicon nitride, it improved the flexural strength and the fracture toughness. Both the flexural strength and the fracture toughness of silicon nitride with the aligned whisker seeds were increased as the amount of the sintering additives was increased.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.17-21
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• 2013

Sn whiskers are one of the serious causes of the failure of electronics. Sn whiskers grow spontaneously from Sn-based, lead-free finished surfaces, even at room temperature. A primary factor of these Sn whiskers growth is compressive stress, which enhances the diffusion of Sn or other elements. The sources of compressive stress are the growth of non-uniform large intermetallic compounds along the interface between the Sn grain boundary and Cu substrate. Recent studies revealed the methods for reducing Sn whisker growth. This paper gives an overview about recent researches for mitigation methods of Sn whisker growth during nearly room temperature storage.

• Journal of the Korean Ceramic Society
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• v.33 no.2
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• pp.203-213
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• 1996

In this study the subcritical crack growth behavior in an Al2O3-SiCw composite has been investigated using in situ fracture technique of applied moment double cantilever beam (AMDCB) specimens indside an SEM. This technique allows the detailed observation of whisker and grain bridging in the crack wake region. The experimental results indicated that the KI-a curve was deviated from the conventional powder law form and that the existed a region where the rate of microcrack growth was decreased with increasing the externally applied stress intensity factor. This behavior could be explained by arising crack growth resistance i.e. R-curve behavior which was associated with crack shielding due to whisker and grain bridging. The R-curve was also analyzed from the KI-a curve data in order to quantify the bridging effect in the Al2O3-SiCw composite.

• Journal of the Korean Ceramic Society
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• v.29 no.8
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• pp.617-622
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• 1992

In order to study on the effect of SiC whisker in flexural strength characterization of macro defect-free (MDF) cement composites, which composed of high alumina cement and polyvinyl alcohol, microstructural characterization of the composite specimens fabricated by the addition of SiC whiskers was investigated. Microproes are created around the SiC whisker, MDF cement didn't react with the SiC whisker. However, flexural strength of the composites have been improved. Fracture morphology of the composites, presents mainly intergranular type fracture passing around the unhydrated particles and siC whiskers, and partially transgranular type fracture. The main strengthening mechanisms of the MDF cement composites reinforced with SiC whiskers are characterized by crack deflection, microcracking, and bridging of cracks.

• Proceedings of the Korean Ceranic Society Conference
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• 2004.04b
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• pp.48.3-48.3
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• 2004

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.213.2-213
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• 2003

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.214.1-214
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• 2003