• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.20 no.3
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• pp.243-259
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• 2016

The Richards equation for water movement in unsaturated soil is highly nonlinear partial differential equations which are not solvable analytically unless unrealistic and oversimplifying assumptions are made regarding the attributes, dynamics, and properties of the physical systems. Therefore, conventionally, numerical solutions are the only feasible procedures to model flow in partially saturated porous media. The standard Finite element numerical technique is usually coupled with an Euler time discretizations scheme. Except for the fully explicit forward method, any other Euler time-marching algorithm generates nonlinear algebraic equations which should be solved using iterative procedures such as Newton and Picard iterations. In this study, lumped mass and distributed mass in the frame of Picard and Newton iterative techniques were evaluated to determine the most efficient method to solve the Richards equation with finite element model. The accuracy and computational efficiency of the scheme and of the Picard and Newton models are assessed for three test problems simulating one-dimensional flow processes in unsaturated porous media. Results demonstrated that, the conventional mass distributed finite element method suffers from numerical oscillations at the wetting front, especially for very dry initial conditions. Even though small mesh sizes are applied for all the test problems, it is shown that the traditional mass-distributed scheme can still generate an incorrect response due to the highly nonlinear properties of water flow in unsaturated soil and cause numerical oscillation. On the other hand, non oscillatory solutions are obtained and non-physics solutions for these problems are evaded by using the mass-lumped finite element method.

• Carbon letters
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• v.7 no.2
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• pp.87-96
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• 2006

This paper describes the physical properties of filled Nylon6 composites resin with nano-sized carbon black particle and graphite nanofibers prepared by melt extrusion method. In improving adhesions between resin and fillers, the surface of the carbon filler materials were chemically modified by thermo-oxidative treatments and followed by treatments of silane coupling agent. Crystallization temperature and rate of crystallization increased with increases in filler concentration which would act as nuclei for crystallization. The silane treatments on the filler materials showed effect of reduction in crystallization temperature, possibly from enhancement in wetting property of the surface of the filler materials. Percolation transition phenomenon at which the volume resistivity was sharply decreased was observed above 9 wt% of carbon black and above 6 wt% of graphite nanofiber. The graphite nanofibers contributed to more effectively in an increase in electrical conductivity than carbon black did, on the other hand, the silane coupling agent negatively affected to the electrical conductivity due to the insulating property of the silane. Positive temperature coefficient (PTC) phenomenon, was observed as usual in other composites, that is, temperature increase results conductivity increase. The dispersity of the fillers were excellently approached by melt extrusion of co-rotational twin screw type and it could be illustrated by X-ray diffraction and SEM.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.5
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• pp.331-337
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• 2017

Thermal batteries, reserve power source, is activated by melting of molten salt at the temperature range of $350{\sim}550^{\circ}C$. To immobile the molten state electrolyte when the thermal battery is activated, the binder must be added in electrolyte. Usually, molten salts include 30~40 wt% of MgO binder to ensure electrical insulation as well as safety. However, the conventional MgO binder tends to increase ionic conductive resistance and thus the inclusion of the binder increases the total impedance of the battery. This paper mainly focused on the study of yttria stabilized zirconia (YSZ) as an alternative binder for molten salt. The chemical stability between the molten salt and YSZ is measured by XRD and DSC. And the sufficient path for ionic conduction on molten salt could be confirmed by the enhanced wetting behavior and the enlarged pore size of YSZ. The electrochemical properties were analyzed using single cell tests so that it showed the outstanding performance than that using MgO binder.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 1999.04b
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• pp.361-365
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• 1999

This study examined the effects of multiple recycling on deinkability and properties of recycled paper from laser computer printout (LCPO). First, alkaline paper with a 20% printed area was disintegrated by TAPPI standard disintegrator at room temperature. After dewatering, the pulp was flotated and dried in oven at80$^{\circ}C$ for 24 hrs. A sequence of wetting, disintegrating, flotating and drying was one recycling cycle and this cyclic treatment was repeated from zero to five times. The recycled handsheet dropped to 90% of the original brightness after five cycles, and lost the most brightness after five cycles, and lost the most brightness in the first two cycles. However, it had a gain of 10% in opacity after five cycles as the same as the case of nonprinting. And, in this study, the method for determining residual ink(toner) content in recycled handsheets ere established by means of SEM-EDX and Py-GC. The change of residual ink percentage on recycled paper showed the effect of recycling numbers on deinkability of waste paper. A slight decrease in deinkability was noted for the recycled handsheets, which may be due to the change of fiber surface free energy connected with fiber swelling.

• Journal of Korea Foundry Society
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• v.20 no.2
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• pp.116-121
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• 2000

Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3 mm $min^{-1}$ to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the ${\gamma}-Cu_5Zn_8$ phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.

• Composites Research
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• v.15 no.6
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• pp.16-23
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• 2002

In this work, the effect of anodic oxidation on surface characteristics of high strength PAN-based carbon fibers was investigated in mechanical interfacial properties of composites. The surface properties of the carbon fibers were determined by acid-base values, scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and contact angles. And their mechanical interfacial properties of the composites were studied in interlaminar shear strength (ILSS) and critical stress intensity factor ($K_{IC}$). As a result, the acidity or the $O_{ls}/C_{ls}$ ratio of carbon fiber surfaces was increased, due to the development of the oxygen functional groups. Consequently, the anodic oxidation led to an increase in surface free energy of the carbon fibers, mainly due to the increase of its specific (or polar) component. The mechanical interfacial properties of the composites, including ILSS and $K_{IC}$, had been improved in the anodic oxidation on fibers. These results were explained that good wetting played an important role in improving the degree of adhesion at interfaces between fibers and epoxy resin matrix.

• Journal of Korean Ophthalmic Optics Society
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• v.18 no.1
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• pp.27-35
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• 2013

Purpose: The present study was conducted to investigate the changes in the physical properties of RGP lenses induced by the polishing during the process of RGP lens manufacturing, and further evaluate the differences in the actual wearer's comfort and the tear film break-up time caused by these changes. Methods: RGP lenses (fluorosilicone acrylate material) were divided into 4 groups by the different lens-polishing time like 0, 25, 50 and 100 seconds and the thickness, the surface roughness and the wetting angle of those lenses were compared. Furthermore, the comfortability of the lens wear was surveyed after applying these lenses on the subject's eyes with normal tear volume and the non-invasive tear break-up time of the wearers was measured. Results: The central thickness of 4 RGP lenses made of different lens-polishing time was not significantly different however, the lens surface was changed smoother after polishing to be confirmed by scanning electron microscopy. The wetting angle of the RGP lens significantly decreased in accordance with the increase of polishing time. Thus, the difference of approximately $16^{\circ}$ between 0 second and 100 seconds-polishing was statistically significant. The actual wearing feeling of RGP lens was tended to improve in accordance with the increase of the lens wettability however, it was not proportional improvement. The non-invasive tear break-up time of the lens wearers showed different aspect compared with the changes in lens wettability and the actual feeling of RGP lens wear. Conclusions: In this study, better lens wettability, thinner lens thickness, and/or improved lens surface induced by physical stimuli in the process of RGP lens manufacturing was not well-correlated with the increase of actual subjective/objective satisfaction in RGP lens wear. Thus, the consideration of physical properties of the lens as well as the lens wearers' physiological factors in the process of RGP lens manufacturing may be suggested.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of Adhesion and Interface
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• v.10 no.1
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• pp.1-10
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• 2009

The waterborne acrylic pressure-sensitive adhesive in the basis of butylacylate (BA) and 2-Ethylhexylacrylate (2-EHA) was synthesized and the methyl methacrylate (MMA) have been used to give the rigidity perfroamce. The polymreric latex was synthesized using butyl acrylate (BA), 2-ethylhexyl acrylate (EHA), methyl methacrylate (MMA) and each 1, 2, 3% of various functional monomers. The dimethyl-2-imidazlidon acrylate and 2-acrylamido-2-methyl-1-propanesulfonate was used in order to increase the wetting properties of acrylic emulsion. To study of properties of functional monomer, The polymreric latex was synthesized various functional monomers each 1, 2, 3%. The 2-acrylamido-2-methyl-1-propanesulfonate showed the best properties. Latex with acrylic acid and dimethyl-2-imidazlidon acrylate had good peel strength, holding power, but it showed that they didn't separate from adhered cleanly by weak cohesion strength. The adhesion performance was increased by increasing amount of 2-acrylamido-2-methyl-1-propanesulfonate however latexes with upper 7% 2-acrylamido-2-methyl-1-propanesulfonate showed that the properties of PSA decreased.