• Korean Journal of Food Science and Technology
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• v.6 no.2
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• pp.109-115
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• 1974

Milssal is a polished, partially gelatinized pressed wheat grain and it is being consumed in Korea. This study was conducted to establish 2 practical means of providing needed lysine to the Korean population through fortification of Milssal. The results are summarized as follow: Lysine infusion of Milssal was significantly higher than polished wheat grain and affected by such factors as time and concentration of infusion solution. Cooking characteristics including water-uptake ratio and expanded volume were apparently better than polished wheat. After conducting the series of fortification experiments under actual manufacturing conditions. a reasonable process was chosen. In the developed process. lysine HCl solution was sprayed instead of water to the cleaned and debranned wheat grains during the regular wetting process. There was no differences in appearance and taste of Milssal before and after fortification. Fortification of the protein of Milssal with lysine has been found to bring a significant improvement in the growth rate of rats and the protein efficiency ratio. Stability remained relatively high throughout the storage period(90 days at $10{\sim}20^{\circ}C$ or 30 days at $37^{\circ}C$).

• Journal of the Korean Society of Groundwater Environment
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• v.6 no.1
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• pp.23-32
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• 1999

A new numerical method using solution-adaptive grids (SAG) is developed to solve the Richards' equation (RE) for unsaturated flow in porous media. Using a grid generation technique, the SAG method automatically redistributes a fixed number of grid points during the flow process, so that more grid points are clustered in regions of large solution gradients. The method uses the coordinate transformation technique to employ a new transformed RE, which is solved with the standard finite difference method. The movement of grid points is incorporated into the transformed RE, and therefore all computation is performed on fixed grid points of the transformed domain without using any interpolation techniques. Thus, numerical difficulties arising from the movement of the wetting front during the infiltration process have been substantially overcome by the new method. Numerical experiments for an one-dimensional infiltration problem are presented to compare the SAG method to the modified Picard method using a fixed grid. Results show that accuracy of a SAG solution using 41 nodes is comparable with the solution of the fixed grid method using 201 nodes, while it requires only 50% of the CPU time. The global mass balance and the convergence of SAG solutions are strongly affected by the time step size (Δt) and the weighting parameter (${\gamma}$) used for generating solution-adaptive grids. Thus, the method requires automated readjustment of Δt and ${\gamma}$ to yield mass-conservative and convergent solutions, although it may increase computational costs. The method can be effective especially for simulating unsaturated flow and other transport problems involving the propagation of a sharp-front.

• Journal of Electrochemical Science and Technology
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• v.11 no.2
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• pp.172-179
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• 2020

The impact of effective parameters on the electrodeposition rate optimization of Au-Cu alloy at high thicknesses on the silver substrate was investigated in the present study. After ensuring the formation of gold alloy deposits with the desired and standard percentage of gold with the cartage of 18K and other standard karats that should be observed in the manufacturing of the gold and jewelry artifacts, comparing the rate of gold-copper deposition by direct and pulsed current was done. The rate of deposition with pulse current was significantly higher than direct current. In this process, the duty cycle parameter was effectively optimized by the "one factor at a time" method to achieve maximum deposition rate. Particular parameters in this work were direct and pulse current densities, bath temperature, concentration of gold and cyanide ions in electrolyte, pH, agitation and wetting agent additive. Scanning electron microscopy (SEM) and surface chemical analysis system (EDS) were used to study the effect of deposition on the cross-sections of the formed layers. The results revealed that the Au-Cu alloy layer formed with concentrations of 6gr·L^-1 Au, 55gr·L^-1 Cu, 24 gr·L^-1 KCN and 1 ml·L^-1 Lauryl dimethyl amine oxide (LDAO) in the 0.6 mA·cm^-2 average current density and 30% duty cycle, had 0.841 ㎛·min^-1 Which was the highest deposition rate. The use of electrodeposition of pure and alloy gold thick layers as a production method can reduce the use of gold metal in the production of hallow gold artifacts, create sophisticated and unique models, and diversify production by maintaining standard karats, hardness, thickness and mechanical strength. This will not only make the process economical, it will also provide significant added value to the gold artifacts. By pulsating of currents and increasing the duty cycle means reducing the pulse off-time, and if the pulse off-time becomes too short, the electric double layer would not have sufficient growth time, and its thickness decreases. These results show the effect of pulsed current on increasing the electrodeposition rate of Au-Cu alloy confirming the previous studies on the effect of pulsed current on increasing the deposition rate of Au-Cu alloy.

• Proceedings of the Korea Water Resources Association Conference
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• 2012.05a
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• pp.34-34
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• 2012

Heavy storms rainfall has caused many landslides and slope failures especially in the mountainous area of the world. Landslides and slope failures are common geologic hazards and posed serious threats and globally cause billions in monetary losses and thousands of casualies each year so that studies on slope stability and its failure mechanism under rainfall are being increasing attention of these days. Rainfall-induced slope failures are generally caused by the rise in ground water level, and increase in pore water pressures and seepage forces during periods of intense rainfall. The effective stress in the soil will be decreased due to the increased pore pressure, which thus reduces the soil shear strength, eventually resulting in slope failure. During the rainfall, a wetting front goes downward into the slope, resulting in a gradual increase of the water content and a decrease of the negative pore-water pressure. This negative pore-water pressure is referred to as matric suction when referenced to the pore air pressure that contributes to the stability of unsaturated soil slopes. Therefore, the importance is the study of saturated unsaturated soil behaviors in evaluation of slope stability under heavy rainfall condition. In an actual field, a series of failures may occur in a slope due to a rainfall event. So, this study attempts to develop a numerical model to investigate this failure mechanism. A two-dimensional seepage flow model coupled with a one-dimensional surface flow and erosion/deposition model is used for seepage analysis. It is necessary to identify either there is surface runoff produced or not in a soil slope during a rainfall event, while analyzing the seepage and stability of such slopes. Runoff produced by rainfall may result erosion/deposition process on the surface of the slope. The depth of runoff has vital role in the seepage process within the soil domain so that surface flow and erosion/deposition model computes the surface water head of the runoff produced by the rainfall, and erosion/deposition on the surface of the model slope. Pore water pressure and moisture content data obtained by the seepage flow model are then used to analyze the stability of the slope. Spencer method of slope stability analysis is incorporated into dynamic programming to locate the critical slip surface of a general slope.

• Journal of Adhesion and Interface
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• v.12 no.3
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• pp.81-87
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• 2011

In this study, UV curing and crosslinking process was introduced for synthesis of acrylic foam tape that can be applied to the the automotive assembly process. Polymerized adhesive are laminated to baseform and varying the thickness of specimens were prepared. To measure basic mechanical properties, stainless steel was used. And in the test peel, dynamic shear and t-block were used. The acrylform adhesive show better results compare with typical adhesive and the properties depand on external factors - thick, wetting time -. To analysis functions of acrylic foam adhesive used to automobile production, evaluate the adhesive properties on the various plastic substrate. In PP and PE are categorized low surface energy materials, their properties have not been expressed. But dynamic shear tests show that some properties could be expressed by the difference break mechanism.

• Applied Chemistry for Engineering
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• v.9 no.2
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• pp.226-231
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• 1998

Hot melt adhesive which is solventless type has been widely used due to the possibility of automated adhesion process. The main purpose of this study is the development of polyamide based hot melt adhesive to improve the property of conventional ethylene-vinyl acetate hot melt adhesive, which has an inherent problem against heat resistance. In this study, it was found that the terpolymers of nylon 6, nylon 66, and nylon 12(CM831, 843P types) instead of nylon homopolymer were suitable base resins for hot melt adhesive, since the disruption of regularity in the polymer chains reduced the crystallinity, resulting in lower melting point and melt viscosity. According to the results, the optimum adhesion property could be obtained by the using 75/25~50/50 weight radio of CM831/843P resin as a base resin. Terpene resin was used as tackifier to improve adhesion and wetting properties. The best result can be obtained with the 10 wt.% addition of terpene resin. The terpene resin acted as proper tackifier in this system which decreased the melt temperature and viscosity, but increased the mechanical strength of adhesive itself. Also, the rheological property of the adhesive changed from typical non-Newtonian behavior to Newtonian behavior as terpene resin was added.

• Korean Journal of Materials Research
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• v.2 no.3
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• pp.180-190
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• 1992

Some solutions to several major problems in ZMR such as agglomeration of polysilicon, slips and local substrate melting are described. Experiments are performed with varying polysilicon thickness and capping oxide thickness. The aggmeration can be eliminated when nitrogen is introduced at the capping oxide layer-to-polysilicon interface and polysilicon-to-buried oxide layer interface by annealing the SOI samples at $1100^{\circ}$ in $NH_3$ ambient for three hours. The slips and local substrate melting are removed when the back surface of silicon substrate is sandblasted to produce the back surface roughness of about $20{\mu}m$. The subboundary spacing increases with increasing polysilicon thickness and the uniformity of recrystallized SOI film thickness improves with increasing capping oxide thickness, improving the quality of recrystallized SOI film. When the polysilicon thickness is about $1.0{\mu}m$ and the capping oxide thickness is $2.5{\mu}m$, the thickness variation of the recrystallized SOI film is about ${\pm}200{\AA}$ and the subboundary spacing is about $70-120{\mu}m$.

• Journal of the Korean Society for Precision Engineering
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• v.3 no.1
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• pp.40-49
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• 1986

Crack, craze and void are common defects which may be found in the bulk of polymeric materials such as either themoplastics or thermosets. The healing phenomena, autohesion, of these defects are known to be a intrinsic material property of various polymeric materials. However, only a few experimental and theoretical investigations on crack, void and craze healing phenomena for various polymeric materials have been reported up to date [1, 2, 3]. This may be partly due to the complications of healing processes and lacking of appropriate theoretical developments. Recently, some investigators have been urged to study the healing phenomena of various polymenic materials since the significance of the use of polymer based alloys or composites has been raised in terms of specific strength and energy saving. In the earlier published reports [1, 2, 3, 4], the crack and void healing velocity, healing toughness and some other healing mechanical and physical properties were measured experimentally and compared with predicted values by utilizing a simple model such as the reptation model under some resonable assumptions. It seems, however, that the general acceptance of the proposed modeling analyses is yet open question. The crack healing processes seem to be complicate and highly dependent on the state of virgin material in terms of mechanical and physical properties. Furthermore, it is also strongly dependent on the histories of crack, craze and void development including fracture suface morphology, the shape of void and the degree of disentanglement of fibril in the craze. The rate of crack healing may be a function of environmental factors such as healing temperature, time and pressure which gives different contact configurations between two separated surfaces. It seems to be reasonable to assume that the crack healing processes may be divided in several distinguished steps like stress relaxation with molecular chain arrangement, surface contact (wetting), inter- diffusion process and com;oete healing (to obtain the original strength). In this context, it is likely that we no longer have to accept the limitation of cumulative damage theories and fatigue life if it is probable to remove the defects such as crack, craze and void and to restore the original strength of polymers or polymer based compowites by suitable choice of healing histories and methods. In this paper, we wish to present a very simple and intuitive theoretical model for the prediction of healed fracture toughness of cracked or defective polymeric components. The central idea of this investigation, thus, may be the modeling of behavior of chain molecules under healing conditions including the effects of chain scission on the healing processes. The validity of this proposed model will be studied by making comparisons between theoretically predicted values and experimentally determined results in near future and will be reported elsewhere.

• Journal of Welding and Joining
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• v.30 no.5
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• Journal of the Korean Geotechnical Society
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• v.29 no.5
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• pp.39-52
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• 2013

The shear stress characteristics of landslide materials can be affected by various factors. We examined the shear stress characteristics of two different soils using ring-shear apparatus, in which saturation-consolidation-shearing speed can be easily controlled. This paper presents (i) shear stress-time characteristics, (ii) shear stress depending on normal stress and shear speed and (iii) shear stress as a function of shearing speed. Materials used in this paper were the Nakdong River sand and muds taken from Jinhae coastal area in Korea. Samples were prepared in three types: Sand (upper)-Sand (lower), Clay (upper)-Clay (lower) and Sand (upper)-Clay (lower). The upper and lower indicate the samples placed in upper and lower ring shear boxes, respectively. For given normal stresses (50 and 100 kPa) and shearing speed (0.1 mm/sec), we performed ring shear tests. Then the failure lines were determined in the second test. Last, we determined the shear stress characteristics depending on different shearing speeds, such as 0.01, 0.1, 1, 10, 100 mm/sec. As a result, we found that shear stress characteristics are strongly dependent on above three factors. The shear stress of Sand (upper)-Clay (lower) is smaller than that of Sand (upper)-Sand (lower), but slightly larger than that of Clay (upper)-Clay (lower). The shear stress is also characterized by grain crushing and wetting process at slip surface.