• Korean Journal of Materials Research
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• v.18 no.1
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• pp.18-21
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• 2008

The wetting behavior of molten Fe on ${\alpha}-Al_2O_3$ single crystals with three different crystallographic orientations, $R(01\bar{1}2),\;A(11\bar{2}0),\;and\;C(0001)$, was investigated using the sessile drop method under a 10%$H_2-Ar$ atmosphere at 1873 K. It was found that the differences in the contact angle of the three differently oriented ${\alpha}-Al_2O_3$ single crystals were not significant (within $5^{\circ}$, which corresponded to the changes in the work of adhesion of $157mJ/m^2$) due to the surface reconstruction.

• Journal of Korean Ophthalmic Optics Society
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• v.15 no.3
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• pp.207-212
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• 2010

Purpose: Rigid gas permeable (RGP) contact lenses, based on fluorosilicone acrylate, were treated with plasma in air. Methods: The chemical compositions were analyzed by using X-ray photoelectron spectroscopy (XPS), the surface morphology and roughness of RGP contact lenses were observed by using atomic force microscopy (AFM), and the wettability changes were estimated by wetting angle measurement. Results: As the contact lenses were treated by the plasma, the F contents decreased significantly, and the O and Si contents increased on the surface. The number of oxygen-containing hydrophilic radicals (C-O and Si-O) increased greatly, the hydrophobic surface decreased, and the wetting angle increased. But the C-O bonds created with exchange of the fluorine did not increase a wettability. The surface compositions were not remarkably changed for the 6 months after plasma treatment, but the wetting angle increased again. Conclusions: It was considered that the improved wettability of the RGP contact lenses of high fluorine content after plasma treatment was affected by the activation of surface, the increase of Si-O, and the decrease of hydrophobic surface.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.6
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• pp.533-538
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• 2014

We fabricated grooved mushroom structures with anisotropic wettability on silicon substrates using basic MEMS processes. The geometry of these grooved mushroom structures could be changed by controlling the additional IPA solution during Si etching by TMAH solution. To understand anisotropic wettability, contact angles (CAs) of hexadecane droplets were measured in the orthogonal and parallel directions to grooved lines. The CA measurement results displayed anisotropic wetting on the grooved mushroom structures. However, specimens with $80{\mu}m$ distance between top layers displayed isotropic and superoleophobic wetting. This study demonstrates that the thickness of the top layer is more critical than the width or height of the ridge when determining the wettability of organic solvent. Despite the wide distance between top layers ($80{\mu}m$), the specimen with a thin top layer (100 nm) showed highly anisotropic wetting and low CA due to the pinning of droplets at the edge of the top layer.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.37 no.2 s.110
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• pp.47-56
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• 2005

In technology of ink-jet coating, Image quality from correlation between paper and ink depends on the properties of printer and ink as well as those of paper material. Generally, According to the quality of ink that consists of colorants from 5 to 20 percent, It seems that absorption behavior of each ink is different. In this study, we studied to estimate the effects of dye and pigment ink on the absorption and printing properties using 2-type papers on the market and 3-type silica-based coated papers whose pore structure is different. Using the theory of contact angle to evaluate the absorption property, it was possible to measure the baseline length between paper and ink, volume of droplet as well as contact angle. Also, It was possible to calculate wetting energy(mN/m) and spreading coefficient(mN/m) using the surface tension of each ink. These measurements were available to estimate ink-jet qualities.

• The Korean Journal of Rheology
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• v.11 no.1
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• pp.34-43
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• 1999

Flow-induced voids during resin impregnation and poor fiber wetting have known to be highly detrimental to the performance of composite parts manufactured by resin transfer molding(RTM) process. In this study, in order to overcome these serious problems encountered in RTM, the effects of surface modification by using silane coupling agent as a surface modifier on the flow characteristics, the wetting between resin and fiber, and void content were investigated. For the experiments of microscopic flow visualization and curing in a beam mold, glass fiber mats having plain weaving structure and epoxy resin were used. Modifying the fiber surface was found to result in a significant decrease of dynamic contact angle between resin and fiber and increase of wicking rate. Therefore, it was confirmed that the surface modification employed in this study could improve the wettability of reinforcing fibers as well as micro flow behavior. In addition, It was revealed that high temperature and low penetration rate of the resin are more favorable processing conditions to reduce the dynamic contact angle. However, surface modified fiber mat was found to have lower permeability than the unmodified one, which may be explained in terms of the decrease of contact time between resin and fiber owing to improvement of wetting. It was also exhibited that surface modification had a significant influence on void formation in RTM process, resulting in a decrease of overall void content due to the improvement of wetting in cured composite parts.

• The Journal of Korean Academy of Prosthodontics
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• v.57 no.4
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• pp.335-341
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• 2019

Purpose: Chemically strong-acids (HF and $HCl/H_2SO_4$) dual etching implant surfaces have higher strengths of osseointegration than machined implant surfaces. However, the dual acid treatment deteriorates the physical properties of the titanium by weakening the fatigue resistance of the implant and causing microcracks. The removal torque comparison between the dual-acid etched (hydrochloric acid, sulfuric acid, HS) and single-acid etched implants (hydrochloric acid, H) could reveal the efficiency of implant surface acid treatment. Materials and methods: Nine $3.75{\times}4mm$ dual-acid etched SLA implants and nine single-acid etched SLA implants were inserted into New Zealand rabbit tibias. After 10 days, removal torque, roughness, and wetting angle were measured. Results: Mean removal torque values were as follows: Mean removal torque were 9.94 Ncm for HS group and 9.96 Ncm for H group (P=.995). Mean surface roughness value were $0.93{\mu}m$ for HS group and $0.84{\mu}m$ for H group (P=.170). Root mean square roughness (RSq) values were $1.21{\mu}m$ for HS group and $1.08{\mu}m$ for H group (P=.294), and mean wetting angle values were $99^{\circ}$ for HS group and $98^{\circ}$ for H group (P=.829). Statistical analysis showed no significant difference between the removal torques, roughness, or wetting angles of the two groups. Conclusion: In this experiment, we found no significant difference in removal torque, roughness, or wetting angle between dual-acid etched and single-acid etched implants.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.56.1-56.1
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• 2005

• Proceedings of the Korean Vacuum Society Conference
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• 2008.02a
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• pp.165-165
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.247-248
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• 2011

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.1080-1083
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• 2002

In this paper, we have studied with regard to the use of lasers for modifying the surface properties of silicon in order to improve it's wettability and adhesion characteristics. Using an Nd:YAG pulse laser, the wettability and adhesion characteristics of silicon surface have been developed by an Nd:YAG pulse laser. It was found that the laser treatment of silicon surfaces modified the surface energy. In the result of wetting experiments, by the sessile drop technique using the distilled water, wetting characteristic of silicon after the laser irradiation shows a decreased value of the contact angle. In case of the laser treated silicon surface, laser direct writing of copper lines has been achieved by pyrolytic decomposition of copper formate films$(Cu(HCOO)_2{\cdot}4H_2Q)$, using a focused $Ar^+$ laser beam$(\lambda=514.5nm)$ on the silicon substrates. The deposited patterns were measured by energy dispersive X-ray(EDX), Scanning Electron Microscopy(SEM) and surface profiler($\alpha$-step) to examine the cross section of deposited copper lines and linewidth.