• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.423-423
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• 2012

Recently, many researchers made progress in various studies improving the efficiency of dye-sensitized solar cell. In this paper, we used glass textured by wet-chemical etching process for improvement of photocurrent density in dye-sensitized solar cells. This is owing to increase coefficient of light utilization. Consequently, DSSC using the textured glass exhibit a Jsc of 9.49 mA/$cm^2$, a Voc of 0.73 V and a fill factor (FF) of 0.67 with an overall conversion efficiency of 4.64. This result showed increasing of 20% current density and 16% conversion efficiency using the textured glass. These results suggested that glass texturing was very effective in controlling the light-scattering properties into the photovoltaic cell.

• Progress in Superconductivity
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• v.11 no.1
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• pp.72-77
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• 2009

Low temperature scanning laser microscopy (LTSLM) can be used for a two-dimensional display of bolometric response arising from the localized excitation of a sample by the focused laser beam. In this study, the distribution of critical temperature ($T_c$) and critical current density ($J_c$) in YBCO coated conductor were analyzed using LTSLM. For improving the temperature stability, we have modified the system into a double-shielding type. Through the modification, the temperature stability was successfully improved from ${\pm}10mK\;to\;{\pm}2mK$. The superconducting properties of YBCO coated conductors were measured for the sample of a narrow bridge type using wet etching process. The spatial non-uniformity of the ac voltage response, ${\delta}V(x)$, which is proportional to ${\partial}\rho(x,J_B)/{\partial}T$ in the transition temperature region could be observed and displayed in a two-dimensional image.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.11a
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• pp.289-292
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• 2009

The fabrication method of glass bipolar plates for micro PEM fuel cell application has been established and performance evaluation has been carried out. The advantages of glass bipolar plates for micro PEM fuel cells are light weight, high chemical resistivity, and easy manufacture. The MEMS fabrication process of anisotropic wet etching, thermal & UV bonding along with metal layer deposition has been introduced. From performance evaluation, it was shown that the micro fuel cell with a metal layer deposited on the reactive area yielded higher power density than the one without it. But both power densities of the two cases showed out to be adequate with the current status of micro fuel cell technology.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.9-19
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• 2020

Transferring of functional nanofilms onto target substrates is a cornerstone to developing nanofilm-based nextgeneration applications. In this work, we provide a brief review of recent advances on nanofilm transfer methods by categorizing them into the following three methods: wet-etching transfer, electrochemical delamination, and mechanical transfer. Furthermore, the mechanical transfer method, which is regarded as a promising technology owing to its facile, substrate recyclable, and widely applicable process, is overviewed by focusing on fracture mechanics approaches. Finally, the perspectives and challenges for future development of the mechanical transfer method are discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.813-815
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• 2008

We prepared highly transparent and conductive Oxide/Metal/Oxide(OMO) multilayer by sputtering and developed wet etching process of OMO with a clear edge shape for the first time. The transmittance and sheet-resistance of the OMO are about 89% and $3.3\;{\Omega}/sq.$, respectively. We adopted OMO as a gate electrode of transparent TFT (TTFT) array and integrated OLED on top of the TTFT to result in high aperture ratio of bottom emission AM-OLED.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2007.04a
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• pp.91-94
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• 2007

The fabrication and firing test of the ignition system for a micro solid propellant thruster are described in the present paper. Pt igniter coil was patterned on the glass membrane that was fabricated by the wet etching process. The thickness of Pt layer was $2000{\AA}$ and the width of igniter pattern was $40{\mu}m$. The thickness and diameter of glass membrane were $15{\mu}m$ and 1 mm, respectively. Ignition test was performed. Successful ignition of HTPB/AP propellant was obtained with an ignition delay of 1.6 s at an input voltage of 12 V. The ignition energy was estimated to be 1.4 J.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.91-94
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• 2011

This paper presents light transmission efficiency by optical adhesive thickness between MLA and aperture layer and by aperture hole size. The gap between MLA and Aperture layer is adjusted by the shim. The more optical adhesive thickness increases, the better light transmission efficiency increases up to a point. After that, the light transmission efficiency decreases because stray lights cannot transmit through the aperture layer owing to cut-off by aperture layer. And as a result of light transmission efficiency with changing aperture hole size, the light transmission efficiency is proportional to area of aperture hole. The more specified process is made, the better data and sample will be got.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1623-1624
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• 2006

It is a paper for design, manufacture and estimation of industry inkjet head. Simulations for Actuator, Ink flow and Ejection are executed for securing design ability. Relations between droplet and properties of ink are explained closely through simulation for nozzle. Actually, two silicon plates are made by dry and wet etching and directly bonded. PZT materials is attached on the bended ink flow part and cut to $540{\mu}m$ interval by dicing saw. Actuator was seen variation within 10% between simulation and actual head. Through the ejection estimation, it is shown that stabilized driving voltages change according to viscosity and surface tension of metal ink. Using the metal ink of viscosity of 4.8 cps and surface tension of 0.025 N/m, it is possible to eject the stable droplets with 5m/s, 20 pl, 5 kHz.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.326-329
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• 2005

As a flexible method to fabricate sub-micrometer patterns, Focused Ion Beam (FIB) instrument and Self-Assembled Monolayer (SAM) resist are introduced in this work. FIB instrument is known to be a very precise processing machine that is able to fabricate micro-scale structures or patterns, and SAM is known as a good etch resistance resist material. If SAM is applied as a resist in FIB processing fur fabricating nano-scale patterns, there will be much benefit. For instance, low energy ion beam is only needed for machining SAM material selectively, since ultra thin SAM is very sensitive to $Ga^+$ ion beam irradiation. Also, minimized beam spot radius (sub-tens nanometer) can be applied to FIB processing. With the ultimate goal of optimizing nano-scale pattern fabrication process, interaction between SAM coated specimen and $Ga^+$ ion dose during FIB processing was observed. From the experimental results, adequate ion dose for machining SAM material was identified.

• Korean Journal of Materials Research
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• v.17 no.9
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• pp.453-457
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• 2007

Interest in use of ink-jet printing for pattern-on-demand fabrication of metal interconnects without complicated and wasteful etching process has been on rapid increase. However, ink-jet printing is a wet process and needs an additional thermal treatment such as an annealing process. Since a metal ink is a suspension containing metal nanoparticles and organic capping molecules to prevent aggregation of them, the microstructure of an ink-jet printed metal interconnect 'as dried' can be characterized as a stack of loosely packed nanoparticles. Therefore, during being treated thermally, an inkjet-printed interconnect is likely to evolve a characteristic microstructure, different from that of the conventionally vacuum-deposited metal films. Microstructure characteristics can significantly affect the corresponding electrical and mechanical properties. The characteristics of change in microstructure and electrical resistivity of inkjet-printed silver (Ag) films when annealed isothermally at a temperature between 170 and $240^{\circ}C$ were analyzed. The change in electrical resistivity was described using the first-order exponential decay kinetics. The corresponding activation energy of 0.44 eV was explained in terms of a thermally-activated mechanism, i.e., migration of point defects such as vacancy-oxygen pairs, rather than microstructure evolution such as grain growth or change in porosity.