• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.171-171
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• 2008

본 연구는 초음파 알루미늄 웨지 및 금 볼 본딩을 동시에 적용 가능한 본딩 Pad의 금속학적 안정성을 고려한 표층전극 형성 방법에 관한 것이다. 특히, 이동통신 및 전장용 모듈의 복합 및 융합화로 LTCC기판 패키징에 있어서 다양한 본딩 기술이 요구되고 있다. 전통적인 interconnection 기술인 Au ball 본딩 및 초음파 에너지를 이용한 Al wedge 본딩 기술이 동시에 사용되어야 하는 패키지 구조의 경우 본딩 패드의 표층전극 설계는 서로 상충되는 조건이 요구된다. 따라서, 본 연구에서는 LTCC기판의 표층전극의 Metal finish 방법으로 이용되는 ENEPIG(무전해 Ni/Pd/Au도금)공법으로 Au ball 본딩 및 초음파 Al wedge 본딩을 동시에 가능하게 하는 solution을 제시하여 패키징 자유도뿐만 아니라 Interconnection 신뢰성을 확보할 수 있었다.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2004년도 춘계 학술발표회 제16권1호
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• pp.80-83
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• 2004

The FRP plate or sheet bonding technology was widely used for strengthening deficient RC structures. The strengthened structure using FRP bonding scheme, however, experience the complex interfacial behaviour which is difficult to predict. Therefore, the unbonded scheme using some anchorage device can be is an alternative for more reliable design. In this study, wedge-type anchor for FRP plate is developed for the unbonded flexural strengthening scheme. Some parameter study using 2D finite element method is performed. The analysis parameters are taken as wedge-guide friction coefficients, wedge- FRP ,.friction coefficient and wedge inclination angle. Based on the parameter study, more efficient anchors are designed and tested. The test result show that the developed anchor assure about $80\%$ FRP strength, which is higher performance than typical bonding scheme. Last, 3D finite element analysis is performed.

• 한국생산제조학회지
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• 제22권4호
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• pp.717-722
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• 2013

In this study, we investigated the design of a wire wedge bonding ultrasonic tool horn using finite element method (FEM) simulations. The proposed method is based on an initial design estimate obtained by FEM analysis. An ultrasonic excitation causes various vibrations of a transducer horn and capillary. A simulated ultrasonic transducer horn and resonator are then built and characterized experimentally using a laser interferometer and electrical impedance analyzer. The vibration characteristics and resonance frequencies close to the exciting frequency are identified using ANSYS. FEM analysis is developed to predict the resonance frequency of the ultrasonic horn and use it in the optimal design of an ultrasonic horn mode shape.

• ETRI Journal
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• 제28권5호
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• pp.648-651
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• 2006

In this letter we present a right-angle-bent coplanar waveguide (CPW) which we developed for the application of the driver amplifier-integrated (DAI) 40 Gbps traveling wave electroabsorption modulated laser module. The developed CPW realized parallel progression of the radio frequency (RF) and light using a dielectric overlay structure and wedge bonding on the bending section. The measured $S_{11}$ and $S_{21}$ of the developed CPW were kept below-10 dB up to 35 GHz and -3 dB up to 43 GHz, respectively. These measured results of the CPW were in good agreement with the simulation results and demonstrated the applicability of the CPW to the 40 Gbps communication module.

• 대한치과보존학회:학술대회논문집
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• 대한치과보존학회 2001년도 추계학술대회(제116회) 및 13회 Workshop 제3회 한ㆍ일 치과보존학회 공동학술대회 초록집
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• pp.558.1-558
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• 2001

Flowable resin composite is a relatively new restorative material. It has been reported that a low viscosity, low modulus intermediate resin applied between the bonding agent and restorative resin act as an "elastic buffer" that can relieve contraction stress. This in-vitro study aimed to evaluate the effect of flowable composite resin as a restorative material on regional tensile bond stredgth to cervical wedge shaped cavity walls. (omitted)

• 한국전기전자재료학회논문지
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• 제11권12호
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• pp.1079-1083
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• 1998

In this study, ultrasonic power of Aluminum wire bonder, bond time and bond force are investigated and valued in order to minimize failure of bonding pad lift. We also tried to control those 3 factors properly. We got the conclusion that if we turn down the ability of ultrasonic power or bond time, we can get a pad lift from a boundary between bond pad ad wire because pad metal and wire joining is unstable, but it is best condition when it ultrasonic power is 100∼130unit, bond time is 15∼20msec and bond force is 4∼6gf.

• Restorative Dentistry and Endodontics
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• 제27권3호
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• pp.257-269
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• 2002

Objective : The purpose of this study was to evaluate the resin infiltration into dentin of one-bottle adhesive systems and self-etching primer bonded to Class V cavities using confocal laser scanning microscope(CLSM). Material and Methods : Forty Class V cavities were prepared from freshly extracted caries-free Human teeth. These teeth were divided into two groups based on the presence of cervical abrasion: Group I, cervical abrasion : Group II, wedge-shaped cavity preparation. Resin-dentin interfaces were produced with two one-bottle dentin bonding systems-ONE COAT BOND(OCB; Coltene$^R$) and Syntac$^R$SPrint$^{TM}$(SS; VIVADENT)-, one self-etching priming system-CLEARFIL$^{TM}$ SE BOND (SB : KURARAY)- and one multi-step dentin bonding system-Scotchbond$^{TM}$Multi-Purpose (SBMP, 3M Dental Products)-as control according to manufacturers' instructions. Cavities were restored with Spectrum$^{R}$(Dentsply). Specimens were immersed in saline for 24 hours and sectioned longitudinally with a low-speed diamond disc. The resin-dentin interfaces were microscopically observed using CLSM. The quality of resin-infiltrated dentin layers were evaluated by five dentists using 0~4 scale. Results : Confocal laser scanning microscopal investigations using primer labeled with rhodamine B showed that the penetration of the primer occurred along the cavity margins. Statistical analysis using one-way ANOVA followed by Duncan's Multiple Range test revealed that the primer penetration of the group 2(wedge-shaped cavity preparation) was more effective than group 1(cervical abrasion) and that of the gingival interfaces was more effective than the occlusal interfaces. In the one-bottle dentin bonding systems, the resin penetration score of OCB was compatible to SBMP, but those of SS and self-etching priming system, SB were lower than SBMP.

• 한국추진공학회지
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• 제10권4호
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• pp.47-53
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• 2006

본 논문에서는 탄소-페놀 복합재로 제조된 로켓 노즐 내열부품의 고온에서의 거동을 3차원 축대칭 유한요소 모델을 사용하여 해석하였다. 실제 작동 조건을 사용하여 카울 영역의 적층링을 해석한 결과 층각도, 축방향 치수, 경계조건은 적층링 내부의 응력 분포에 큰 영향을 주는 것으로 확인되었다. 특히 링과 링 사이의 접합부분에서 모서리 탈락 현상의 전조 현상인 층간분리가 발생한다. 분리현상 이후에는 층각도 방향 전단응력과 축방향 압축응력에 의해 탈락 현상이 발생하는 것으로 판단된다.

• 대한치과보존학회:학술대회논문집
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• 대한치과보존학회 2001년도 추계학술대회(제116회) 및 13회 Workshop 제3회 한ㆍ일 치과보존학회 공동학술대회 초록집
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• pp.576.2-576
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• 2001

The purpose of this study was to evaluate the effect of dentinal sclerosis and tubular orientation on Class V restoration bonded with three dentin bonding agents using confocal laser scanning microscope(CLSM). Class V cavities were prepared from freshly extracted caries-free human teeth. thirty of these cavities were divided into two groups based upon the status of class V cavities: Group 1, cervical abrasive lesions without preparation; Group 2, artificially-prepared wedge-shaped cavities.(omitted)