• Proceedings of the KIPE Conference
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• 2006.06a
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• pp.470-474
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• 2006

This dissertation discuses about a ferrite core plasma source using low operating frequency without sputtering problem by the stored electric field. Compared with the conventional RF power system with 13.56MHz switching frequency, the proposed plasma power system is only separated at 400kHz, so that it makes possible to use of low cost switching elements, PWM control and soft switching. Moreover, it could improve the coupling efficiency for plasma and antenna by using the ferrite core in order to transfer the energy of the load This dissertation tried to analyze new plasma generation method for the plasma generation system by modeling the plasma load and grafting the concept of impedance matching in order to interpret it with the formula This dissertation verified the ferrite core inductive coupling plasma source authorized for 400kHz of low frequency power by applying to the semi-conductor ash process thru the measurement of ash capacity and uniformed plasma distribution on the actual wafer.

• Vacuum Magazine
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• v.2 no.1
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• pp.10-16
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• 2015

With the recognition of nanotechnology as one of the future strategic technologies, the R&D efforts have been performed under exclusive supports of governments and private sectors. At present, nanotechnology is at the focus of research and public attention in almost every advanced country including USA, Japan, and many others in EU. Keeping tracks of such technical trends, center for nanoscale mechatronics and manufacturing (CNMM) was established in 2002 as a part of national nanotechnology promotion policy led by ministry of science and technology (MOST) in Korea. It will hold widespread potential applications in electronics, optical electronics, biotechnology, micro systems, etc, with the promises of commercial visibility and competitiveness. In this paper, wafer scale multilayer nanoimprint lithography technology which is well-known the next generation lithography, roll-typed nanoimprint lithography (R-NIL), roll-typed liquid transfer imprint lithography (R-LTIL), the key technology for nanomanufacturing and nanoscale measurement technology will be introduced. Additionally, its applications and some achievements such as solar cell, biosensor, hard disk drive, and MOSFET, etc by means of the developed multilayer nanoimprint lithography system are introduced.

• Journal of the Semiconductor & Display Technology
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• v.4 no.3 s.12
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• pp.29-33
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• 2005

As the integrated devices become more and more sophistcated, the diameter of wafers increased up to 300 mm and strict level of cleaning is necessary to remove the particulates on the surface of wafer. Therefore we need a new type of wet-station which can reduce DI water and chemical in the cleaning process. Moreover, it is important to control the temperature and the concentration of chemical in the wet-station. In the conventional chemical supply system, it is difficult not only to fit the mixing rate of chemicals in cleaning process, but also to fit the quantity and temperature. Thus, we propose a new chemicals supply system, which overcomes above problems by the analysis of fluid and thermal transfer on chemical supply system.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1497-1499
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• 2000

We give pressure stimulation into organic thin films and then manufacture a device under the accumulation condition that the state surface pressure is 30 [mN/m]. LB layers of Arac. acid deposited by LB method were deposited onto y-type silicon wafer as y-type film. In processing of a device manufacture. we can see the process is good from the change of a surface pressure for organic thin films and transfer ratio of area per molecule. The structure of manufactured device is Au/arachidic acid/Al. the number of accumulated layers are 9$\sim$21. Also. we then examined of the MIM device by means of I-V. The I-V characteristic of the device is measured from -3 to +3[V]. The insulation property of a thin film is better as the distance between electrodes is larger.

• Journal of the Semiconductor & Display Technology
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• v.15 no.1
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• pp.41-46
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• 2016

In this study, gas flow and temperature distribution in the multi-wafer planetary CVD reactor for the Si epitaxial growth were analyzed. Although the structure of the reactor was simplified as the first step of the study, the three-dimensional analysis was performed taking all these considerations of the revolution of the susceptor and the rotation of satellites into account. From the analyses, a reasonable velocity field and temperature field were obtained. However, it was found that analyses including the upper structure of the reactor were required in order to obtain more realistic temperature results. DCS mole fraction above the satellite surface and the susceptor surface without satellite was compared in order to check the gas species mixing. We found that satellite rotation helped gases to mix in the reactor.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.45 no.3
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• pp.40-48
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• 2022

An automated material handling system (AMHS) has been emerging as an important factor in the semiconductor wafer manufacturing industry. In general, an automated guided vehicle (AGV) in the Fab's AMHS travels hundreds of miles on guided paths to transport a lot through hundreds of operations. The AMHS aims to transfer wafers while ensuring a short delivery time and high operational reliability. Many linear and analytic approaches have evaluated and improved the performance of the AMHS under a deterministic environment. However, the analytic approaches cannot consider a non-linear, non-convex, and black-box performance measurement of the AMHS owing to the AMHS's complexity and uncertainty. Unexpected vehicle congestion increases the delivery time and deteriorates the Fab's production efficiency. In this study, we propose a Q-Learning based dynamic routing algorithm considering vehicle congestion to reduce the delivery time. The proposed algorithm captures time-variant vehicle traffic and decreases vehicle congestion. Through simulation experiments, we confirm that the proposed algorithm finds an efficient path for the vehicles compared to benchmark algorithms with a reduced mean and decreased standard deviation of the delivery time in the Fab's AMHS.

• KIEE International Transaction on Electrical Machinery and Energy Conversion Systems
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• v.11B no.3
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• pp.112-118
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• 2001

In the near future, the voltage of power system for passenger vehicle will be changed to 42V from existing 14V./ Because of increasing power and voltage ratings used in the vehicle the motor drive system has high switching dv/dt and it generates electromagnetic interference (EMI) To solve these problems multi-level inverter system may be used The feature of multi-level inverter is the output voltage to be synthesized from several levels of voltage Because of this feature high switching dv/dt and EMI can be reduced in the multi-level inverter system But as the number of level is increased manufacturing cost is getting expensive and system size is getting large. Because of these disadvantages the application of multi-level inverter has been restricted only to high power drives. The method to reduce manufacturing cost and system size is to integrate circuit of multi-level inverter into a few chips But isolated power supply and signal isolation circuit using transformer or opto-coupler for drive circuit are obstacles to implement the integrated circuit (IC) In this paper a drive circuit of 4-level inverter suitable for integration to hybrid or one chip is proposed In the proposed drive circuit DC link voltage is used directly as the power source of each gate drive circuit NPN transistors and PNP transistors are used to isolate to transfer the control signals. So the proposed drive circuit needs no transformers and opto-couplers for electrical isolation of drive circuit and is constructed only using components to be implemented on a silicon wafer With th e proposed drive circuit 4- level inverter system will be possible to be implemented through integrated circuit technology Using the proposed drive circuit 4- level inverter system is constructed and the validity and characteristics of the proposed drive circuit are proved through the experiments.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.7 no.4
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• pp.578-588
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• 1997

Poly-$Si_{1-x}Ge_x$ films on oxidized Si wafer were prepared by rapid thermal chemical vapor deposition using the $SiH_4$ and $GeH_4$ gaseous mixture at various deposition conditions. The deposition temperature, $SiH_4\;: GeH_4$ flow ratio and pressure were varied from 400 to $600^{\circ}C$, 1 : 0.1-2 : 1 and 1 to 50 torr, respectively. In this work, we have investigated the change of Ge composition of poly-$Si_{1-x}Ge_x$ films deposited with the variation of deposition parameters and the effect of Ge composition on the deposition rate. From the experimental results, it was observed that the deposition rate increased with increasing deposition temperature and Ge composition. On the other hand, the Ge composition decreased with increasing temperature. As the deposition pressure increased, the deposition rate and Ge composition were increased linearly to 10 torr but increased slowly above it, which has been attributed to the slower rate of surface reaction than mass transfer.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.2
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• pp.260-266
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• 2002

DLC films were deposited on Si wafer by RF plasma assisted CVD using CH4 gas. Tribological tests were conducted using rotating type ball on disk friction tester in dry air. Four kinds of mating balls were used. The mating balls were made with stainless steel but apply different annealing conditions to achieve different hardness conditions. Testing results in all load conditions showed that the harder the mating materials, the lower the friction coefficient among the three kind of martensite mating balls. In case of austenite balls, the friction coefficients were lower than fully annealed martensite ball. The high friction coefficient in soft martensite balls seems to be caused by the larger contact area between DLC film and ball. The wear tracks of DLC films and mating balls could have proven that effect. Measuring the wear track of both DLC films and mating balls have similar tendency comparing to the results of friction coefficients. Wear rate of austenite balls were also smaller than that of fully annealed martensite ball. The results of effect of applying load showed, the friction coefficients were become decrease when the applying loads exceed critical load conditions. The wear track of mating balls showed that some material transfer occurs from DLC film to mating ball during the high friction process. Raman spectra analysis showed that transferred material was a kind of graphite and contact surface of DLC film seems to undergo phase transition from carbon to graphite during the high friction process.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.10
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• pp.113-123
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• 1990

Tungsten film was deposited on the single crystal silicon wafer in a low pressure chemical vapor deposition reactor from silane and tungsten hexafluoride in the temperature range of $250-400^{\circ}C$ Deposition rate was found to be determined by the mass transfer rate of reactants from the gas phase to the safter surface. It was found out that tungsten films deposited contained about 3 atomic $\%$ of silicon and that the crystallinity and the grain size increased as the deposition temperature was increased. The resistivity of the film was measured to be in the range of $7~25{\mu}{\Omega}-cm$ and decreased with increasing deposition temperature. The adhesion of the tungsten film on a silicon surface was measured by the tape peel off test and it was improved with increasing deposition temperature. From the analysis of the gas composition, the reaction pathway to form $SiF_{4}$ and $H_{2}$ was found to be more favorable than HF formation.