• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.29-37
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• 2021

A 7 nm technology node using extreme ultraviolet lithography with a wavelength of 13.5 nm has been recently developed and applied to the semiconductor manufacturing process. Furthermore, the development of sub-3 nm technology nodes continues to be required. In this study, design factors of an electrostatic deflector for an ultra-miniaturized microcolumn system that can realize an electron wavelength of below 1.23 nm with an acceleration voltage of above 1 eV were investigated using a three-dimensional simulator. Particularly, the optimal design of the electrostatic octupole floating deflector was derived by optimizing the design elements and improving the driving method of the 1 keV low energy ultra-miniaturized microcolumn deflector. As a result, the entire wide field of view greater than 330 ㎛ at a working distance of 4 mm was realized with an ultra-high-resolution electron beam spot smaller than 10 nm. The results of this study are expected to be a basis technology for realizing a wafer-scale multi-array microcolumn system, which is expected to innovatively improve the throughput per unit time, which is the biggest drawback of electron beam lithography.

• Journal of the Korea Society of Computer and Information
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• v.27 no.5
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• pp.55-67
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• 2022

Sensor data can provide fault diagnosis for equipment. However, the cause analysis for fault results of equipment is not often provided. In this study, we propose an explainable convolutional neural network framework for the sensor-based time series classification model. We used sensor-based time series dataset, acquired from vehicles equipped with sensors, and the Wafer dataset, acquired from manufacturing process. Moreover, we used Cycle Signal dataset, acquired from real world mechanical equipment, and for Data augmentation methods, scaling and jittering were used to train our deep learning models. In addition, our proposed classification models are convolutional neural network based models, FCN, 1D-CNN, and ResNet, to compare evaluations for each model. Our experimental results show that the ResNet provides promising results in the context of time series classification with accuracy and F1 Score reaching 95%, improved by 3% compared to the previous study. Furthermore, we propose XAI methods, Class Activation Map and Layer Visualization, to interpret the experiment result. XAI methods can visualize the time series interval that shows important factors for sensor data classification.

• Journal of Conservation Science
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• v.38 no.1
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• pp.14-32
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• 2022

Underwater photographing and image recording are essential for pre-excavation survey and during excavation in underwater archaeology. Unlike photographing on land, all underwater images suffer various quality degradations such as shape distortions, color shift, blur, low contrast, high noise levels and so on. Outcome is very often heavily photographing equipment and photographer dependent. Excavation schedule, weather conditions, and water conditions can put burdens on divers. Usable images are very limited compared to the efforts. In underwater archaeological study in very turbid water such as in the Yellow Sea (between mainland China and the Korean peninsula), underwater photographing is very challenging. In this study, off-site image distortion and color compensation techniques using an image processing/analysis software is investigated as an alternative image quality enhancement method. As sample images, photographs taken during the excavation of 800-year-old Taean Mado Shipwrecks in the Yellow Sea in 2008-2010 were mainly used. Significant enhancement in distortion and color compensation of archived images were obtained by simple post image processing using image processing/analysis software (PicMan) customized for given view ports, lenses and cameras with and without optical axis offsets. Post image processing is found to be very effective in distortion and color compensation of both recent and archived images from various photographing equipment models and configurations. Merits and demerit of in-situ, distortion and color compensated photographing with sophisticated equipment and conventional photographing equipment, which requires post image processing, are compared.

• Design & Manufacturing
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• v.16 no.3
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• pp.58-65
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• 2022

Micro-fluidic chip has been fabricated by lithography process on silicon or glass wafer, casting using PDMS, injection molding of thermoplastics or 3D printing, etc. Among these processes, 3D printing can fabricate micro-fluidic chip directly from the design without master or template for fluidic channel fabricated previously. Due to this direct printing, 3D printing provides very fast and economical method for prototyping micro-fluidic chip comparing to conventional fabrication process such as lithography, PDMS casting or injection molding. Although 3D printing is now used more extensively due to this fast and cheap process done automatically by single printing machine, there are some issues on accuracy or surface characteristics, etc. The accuracy of the shape and size of the micro-channel is limited by the resolution of the printing and printing direction or layering direction in case of SLM type of 3D printing using UV curable resin. In this study, the printing direction and thickness of each printing layer are investigated to see the effect on the size, shape and surface of the micro-channel. A set of micro-channels with different size was designed and arrayed orthogonal. Micro-fluidic chips are 3D printed in different directions to the micro-channel, orthogonal, parallel, or skewed. The shape of the cross-section of the micro-channel and the surface of the micro-channel are photographed using optical microscopy. From a series of experiments, an optimal printing direction and process conditions are investigated for 3D printing of micro-fluidic chip.

• Tribology and Lubricants
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• v.38 no.6
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• pp.235-240
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• 2022

Atomically-thin 2D nanomaterials can be easily deformed and have surface corrugations which can influence the frictional characteristics of the 2D nanomaterials. Chemical vapor deposition (CVD) graphene can be grown in a wafer scale, which is suitable as a large-area surface coating film. The CVD growth involves cooling process to room temperature, and the thermal expansion coefficients mismatch between graphene and the metallic substrate induces a compressive strain in graphene, resulting in the surface corrugations such as wrinkles and atomic ripples. Such corrugations can induce the friction anisotropy of graphene, and therefore, accurate imaging of the surface corrugation is significant for better understanding about the friction anisotropy of CVD graphene. In this work, the combinatorial analysis using friction force microscopy (FFM) and transverse shear microscopy (TSM) was implemented to unveil the friction anisotropy of CVD bi-layer graphene. The periodic friction anisotropy of the wrinkles was measured following a sinusoidal curve depending on the angles between the wrinkles and the scanning tip, and the two domains were observed to have the different friction signals due to the different directions of the atomic ripples, which was confirmed by the high-resolution FFM and TSM imaging. In addition, we revealed that the atomic ripples can be easily suppressed by ironing the surface during AFM scans with an appropriate normal force. This work demonstrates that the friction anisotropy of CVD bilayer graphene is well-correlated with the corrugated structures and the local friction anisotropy induced by the atomic ripples can be controllably removed by simple AFM scans.

• The Journal of the Convergence on Culture Technology
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• v.8 no.5
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• pp.749-754
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• 2022

High adhesion and water resistance of the skin surface are required for wearable and skin-attachable electronic patches in various medical applications. In this study, we report a stretchable electronic patch that mimics the drainable structure pattern of the hexagonal channels of frog's pads and the sucker of an octopus based on carbon-based conductive polymer composite materials. The hexagonal channel structure that mimics the pads of frogs drains water and improves adhesion through crack arresting effect, and the suction structure that mimics an octopus sucker shows high adhesion on wet surfaces. In addition, the high-adhesive electronic patch has excellent adhesion to various surfaces such as silicone wafer (max. 4.06 N/cm²) and skin replica surface (max. 1.84 N/cm²) in dry and wet conditions. The high skin-adhesive electronic patch made of a polymer composite material based on a polymer matrix and carbon particles can reliably detect electrocardiogram (ECG) in dry and humid environments. The proposed electronic patch presents potential applications for wearable and skin-attachable electronic devices for detecting various biosignals.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.68-68
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• 2001

Thin films of polycrystalline silicon (poly-Si) is a promising material for use in large-area electronic devices. Especially, the poly-Si can be used in high resolution and integrated active-matrix liquid-crystal displays (AMLCDs) and active matrix organic light-emitting diodes (AMOLEDs) because of its high mobility compared to hydrogenated _amorphous silicon (a-Si:H). A number of techniques have been proposed during the past several years to achieve poly-Si on large-area glass substrate. However, the conventional method for fabrication of poly-Si could not apply for glass instead of wafer or quartz substrate. Because the conventional method, low pressure chemical vapor deposition (LPCVD) has a high deposition temperature ($600^{\circ}C-1000^{\circ}C$) and solid phase crystallization (SPC) has a high annealing temperature ($600^{\circ}C-700^{\circ}C$). And also these are required time-consuming processes, which are too long to prevent the thermal damage of corning glass such as bending and fracture. The deposition of silicon thin films on low-cost foreign substrates has recently become a major objective in the search for processes having energy consumption and reaching a better cost evaluation. Hence, combining inexpensive deposition techniques with the growth of crystalline silicon seems to be a straightforward way of ensuring reduced production costs of large-area electronic devices. We have deposited crystalline poly-Si thin films on soda -lime glass and SiOz glass substrate as deposited by PVD at low substrate temperature using high power, magnetron sputtering method. The epitaxial orientation, microstructual characteristics and surface properties of the films were analyzed by TEM, XRD, and AFM. For the electrical characterization of these films, its properties were obtained from the Hall effect measurement by the Van der Pauw measurement.

• Journal of the Semiconductor & Display Technology
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• v.22 no.1
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• pp.134-138
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• 2023

This study focuses on the analysis of the results of computational fluid dynamics simulations of mist-chemical vapor deposition for the growth of an epitaxial wafer in power semiconductor technology using artificial intelligence techniques. The conventional approach of predicting the uniformity of the deposited layer using computational fluid dynamics and design of experimental takes considerable time. To overcome this, artificial intelligence method, which is widely used for optimization, automation, and prediction in various fields, was utilized to analyze the computational fluid dynamics simulation results. The computational fluid dynamics simulation results were analyzed using a supervised deep neural network model for regression analysis. The predicted results were evaluated quantitatively using Euclidean distance calculations. And the Bayesian optimization was used to derive the optimal condition, which results obtained through deep neural network training showed a discrepancy of approximately 4% when compared to the results obtained through computational fluid dynamics analysis. resulted in an increase of 146.2% compared to the previous computational fluid dynamics simulation results. These results are expected to have practical applications in various fields.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.5
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• pp.442-453
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• 2023

Tandem or multijunction solar cells (MJSCs) can convert sunlight into electricity with higher efficiency (η) than single junction solar cells (SJSCs) by dividing the solar irradiance over sub-cells having distinct bandgaps. The efficiencies of various common SJSC materials are close to the edge of their theoretical efficiency and hence there is a tremendous growing interest in utilizing the tandem/multijunction technique. Recently, III-V materials integration on a silicon substrate has been broadly investigated in the development of III-V on Si tandem solar cells. Numerous growth techniques such as heteroepitaxial growth, wafer bonding, and mechanical stacking are crucial for better understanding of high-quality III-V epitaxial layers on Si. As the choice of growth method and substrate selection can significantly impact the quality and performance of the resulting tandem cell and the terminal configuration exhibit a vital role in the overall proficiency. Parallel and Series-connected configurations have been studied, each with its advantage and disadvantages depending on the application and cell configuration. The optimization of both growth mechanisms and terminal configurations is necessary to further improve efficiency and lessen the cost of III-V on Si tandem solar cells. In this review article, we present an overview of the growth mechanisms and terminal configurations with the areas of research that are crucial for the commercialization of III-V on Si tandem solar cells.