• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.23-24
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• 2006

We present a dispersive scheme of white-light interferometry that enables not only to perform tomographical measurements of thin-film layers but also to measure a refractive index without mechanical depth scanning. The interferometry is found useful particularly for in-situ 3-D inspection of micro-engineered surfaces such as liquid crystal displays, semi-conductor and MEMS structure, which requires for high-speed implementation of 3-D surface metrology.

• Korean Journal of Optics and Photonics
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• v.10 no.5
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• pp.373-378
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• 1999

White light scanning interferometry is increasingly used for precision profile metrology of engineering surfaces, but its current application is primarily limited to opaque surfaces with relatively simple optical reflection behaviors. In this paper, a new attempt is made to extend the interferometric method to the thickness profile measurement of transparent thin film layers. An extensive frequency domain analysis of multiple reflection is performed to allow both the top and bottom interfaces of a thin film layer to be measured independently at the same time using nonlinear least squares technique. This rigorous approach provides not only point-by-point thickness probing but also complete volumetric film profiles digitized in three dimensions.