• Journal of Korean Tunnelling and Underground Space Association
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• v.12 no.1
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• pp.75-85
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• 2010

The focus of this study is to evaluate the field applicability of the newly developed inorganic thixotropic-grout in various ways. In order to do this, the volume stability and the permeability of the inorganic thixotropic-grout have been measured and compared to the existing silica type grouts. In addition, the filling capability of the grout into the tail void has been evaluated through both an experiment with a miniature tail-void filling equipment and a test filling at the shield TBM construction site. The volume loss of the inorganic thixotropic-grout after a 14 day-curing under the atmosphere condition was appeared to be minimal. The excellent waterproofing ability of the inorganic thixotropic-grout was confirmed through a permeability test. The toxicity of the inorganic thixotropic-grout has been evaluated through a toxicity test of aquatic fishes (KS M 0111) and the pH value of the liquid eluviated from inorganic thixotropic-grout was measured as an average of 8.0 and a fatality rate of goldfish after 96 hours was 10% or so. The existence of harmful heavy metals in the liquid eluviated from the inorganic thixotropic-grout has been also examined through an atomic absorption spectroscopy (AAS) test. Any of harmful heavy metals were not detected and the detected level of $Cr^{6+}$ and Cd was far below the standard. Based on both an experiment with a miniature tail-void filling equipment and a test filling at the shield TBM construction site, the filling ability of inorganic thixotropic-grout into the tail void was proved to be excellent.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.12
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• pp.511-517
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• 2016

Current oil-type potential transformers for trains are filled with insulating oil, which could have problems like explosions due to rising inner pressure during train operation. Therefore, mold and dry-type potential transformers are being developed to prevent explosions. One problem in manufacturing mold-type transformers is preventing void formation around the coiled core inside the mold during epoxy filling, which could cause an electrical spark. Micro voids can remain in the resin after filling, and macro voids can occur due to the structure shape. A transformer that is being developed has a cavity at the junction of the core and the coil for better performance, and when highly viscous epoxy flows inside the cavity channel, macro voids can form inside it. Therefore, in this study, the free-surface flow of the mold filling procedure was analyzed numerically by applying the VOF method. The results were used to understand the phenomena of void formation inside the cavity and to modify the process conditions to reduce voids.

• Korean Chemical Engineering Research
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• v.54 no.6
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• pp.723-733
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• 2016

Intensive researches have been focused on the 3-dimensional packaging technology using through silicon via (TSV) to overcome the limitation in Cu interconnection scaling. Void-free filling of TSV by the Cu electrodeposition is required for the fabrication of reliable electronic devices. It is generally known that sufficient inhibition on the top and the sidewall of TSV, accompanying the selective Cu deposition on the bottom, enables the void-free bottom-up filling. Organic additives contained in the electrolyte locally determine the deposition rate of Cu inside the TSV. Investigation on the additive chemistry is essential for understanding the filling mechanisms of TSV based on the effects of additives in the Cu electrodeposition process. In this review, we introduce various filling mechanisms suggested by analyzing the additives effect, research on the three-additive system containing new levelers synthesized to increase efficiency of the filling process, and methods to improve the filling performance by modifying the functional groups of the additives or deposition mode.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.67-88
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• 2005

Mold-Flow 3 Die Stack CSP of Mold array packaging with different Gate types. As high density package option such as 3 or 4 die stacking technologies are developed, the major concerning points of mold related qualities such as incomplete mold, exposed wires and wire sweeping issues are increased because of its narrow space between die top and mold surface and higher wiring density. Full 3D rheokinetic simulation of Mold flow for 3 die stacking structure case was done with the rheological parameters acquired from Slit-Die rheometer and DSC of commercial EMC. The center gate showed severe void but corner gate showed relatively better void performance. But in case of wire sweeping related, the center gate type showed less wire sweeping than corner gate types. From the simulation results, corner gate types showed increased velocity, shear stress and mold pressure near the gate and final filling zone. The experimental Case study and the Mold flow simulation showed good agreement on the mold void and wire sweeping related prediction. Full 3D simulation methodologies with proper rheokinetic material characterization by thermal and rheological instruments enable the prediction of micro-scale mold filling behavior in the multi die stacking and other complicated packaging structures for the future application.

• Proceedings of the Korea Concrete Institute Conference
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• 2002.10a
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• pp.775-780
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• 2002

Sandwich panel made by foamed styrene and ployuretane has been used generally in the construction area because of the high thermal conductivity and light weight but they occur harmful gases to both bodies and environments in the high temperature over $50^{\circ}C$. So, the purpose of this study is to investigate the physical properties of light-weight panel using the non-structural lightweight aggregate as a part of the substitution of foamed styrene and ployuretane. This paper dealt with the effect of the addition of polymer dispersion such as SBR, St/BA-1 and St/BA-2 having polymer-cement ratio as 5, 10, 15% and the filling ratio of continuous void as 50, 60% on the strength of polymer-modified sandwich panel core. From the results, we could know that the compressive and flexural strength of the sandwich panel core using non-structural lightweight aggregate and polymer dispersion such as SBR, St/BA-1 and St/BA-2 tended to be increased with an increase in the polymer-cement ratio and the filling ratio of continuous void.

• Proceedings of the Korea Concrete Institute Conference
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• 2002.05a
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• pp.131-136
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• 2002

In recent year, it has been investigated on the reduction of mass of structures for the purpose of the larger space and the economy with the industry developing very fast and qualitatively. So the purpose of this study is to investigate the manufacture of light weight concrete panel using the artificial light-weight aggregate as a part of the substitution of foamed styrene and polyurethane because of narrow allocable temperature zone in use. The compressive strength, flexural strength, unit weight, absorption test and thermal conductivity were practised at 3, 7 and 28 days after manufacturing the light-weight concrete lot the panel core: the filling ratio of continuous void was defied as 40%, 50%, and 60% and water-cement rate was 35, 40 and 45%. As a result of this, it was revealed that the mixture derived from filling ration of void of 50% and water-cement ratio 40% were developing the best properties of the others.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.37-42
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• 2007

Copper deposition studies have been actively studied since interests on 3D SiP were increased. The defects inside via can be easily formed due to the current density differences on entrance, bottom and wall of via. So far many different additives and current types were discussed and optimized to obtain void-free copper via filling. In this research acid cupric sulfate plating bath containing additives such as PEG, SPS, JGB, PEI and wave current applied electroplating were examined. The size and shape of grain were influenced by the types of organic additives. The cross section of specimen were analyzed by FESEM. When PEI was added, the denser copper deposits were obtained. Electroplaing time was reduced when 2 step via filling was employed.

• Korea-Australia Rheology Journal
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• v.21 no.1
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• pp.71-79
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• 2009

The incomplete saturation and the void formation during the resin infiltration into fibrous porous media in the resin transfer molding process cause failure in the final product during its service. In order to better understand flow behavior during the filling process, a finite-element scheme for transient flow simulation across the micro-structured fibrous media is developed in the present work. A volume-of- fluid (VOF) method has been incorporated in the Eulerian frame to capture the evolution of flow front and the vertical periodic boundary condition has been combined to avoid unwanted wall effect. In the microscale simulation, we investigated the transient filling process in various fiber structures and discussed the mechanism leading to the flow fingering in the case of random fiber distribution. Effects of the filling pressure, the shear-thinning behavior of fluid and the volume fraction on the flow front have been investigated for both intra-tow and the inter-tow flows in dual-scale fiber tow models.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.374-378
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• 2012

In an effort to overcome the problems which arise when fabricating high-aspect-ratio TSV(through silicon via), we performed experiments involving the void-free Cu filling of a TSV(10~20 ${\mu}m$ in diameter with an aspect ratio of 5~7) by controlling the plating DC current density and the additive SPS concentration. Initially, the copper deposit growth mode in and around the trench and the TSV was estimated by the change in the plating DC current density. According to the variation of the plating current density, the deposition rate during Cu electroplating differed at the top and the bottom of the trench. Specifically, at a current density 2.5 mA/$cm^2$, the deposition rate in the corner of the trench was lower than that at the top and on the bottom sides. From this result, we confirmed that a plating current density 2.5 mA/$cm^2$ is very useful for void-free Cu filling of a TSV. In order to reduce the plating time, we attempted TSV Cu filling by controlling the accelerator SPS concentration at a plating current density of 2.5 mA/$cm^2$. A TSV with a diameter 10 ${\mu}m$ and an aspect ratio of 7 was filled completely with Cu plating material in 90 min at a current density 2.5 mA/$cm^2$ with an addition of SPS at 50 mg/L. Finally, we found that TSV can be filled rapidly with plated Cu without voids by controlling the SPS concentration at the optimized plating current density.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.153-157
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• 2013

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.