• 제목/요약/키워드: viscoelastic behavior

검색결과 310건 처리시간 0.028초

핫엠보싱 공정의 폴리머 점탄성 거동에 대한 연구 (Experimental and numerical study on viscoelastic behavior of polymer during hot embossing process)

  • 송남호;손지원;임성한;오수익
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 춘계학술대회 논문집
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    • pp.191-194
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    • 2007
  • In hot embossing lithography which has shown to be a good method to fabricate polymeric patterns for IT and bio components, it is very important to determine the proper process conditions of pressure, temperature, and time. It is also a key factor for predicting the optical properties of final product to calculate residual stress distribution after the embossing process. Therefore, to design the optimum process with right conditions, the ability to predict viscoelastic behavior of polymer during and after the hot embossing process is required. The objective of the present investigation is to establish simulation technique based on constitutive modeling of polymer with experiments. To analyze deformation behavior of viscoelastic polymer, the large strain material properties were obtained from quasi-static compression tests at different strain rates and temperatures and also stress relaxation tests were executed. With this viscoelastic material model, finite element simulation of hot embossing was executed and stress distribution is obtained. Proper process pressure is very important to predict the defect and incomplete filling.

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Linear viscoelastic behavior of acrylonitrile-butadiene-styrene(ABS) polymers in the melt: Interpretation of data with a linear viscoelastic model of matrix/core-shell modifier polymer blends

  • Park, Joong-Hwan;Ryu, Jong-Hoon;Kim, Sang-Yong
    • Korea-Australia Rheology Journal
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    • 제12권2호
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    • pp.135-141
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    • 2000
  • The linear viscoelastic behavior of acrylonitrile-butadiene-styrene (ABS) polymers with different rubber content has been investigated in the frame of a linear viscoelastic model, which takes into account the inter-connectivity of the dispersed rubber particles. The model developed in our previous work has been shown to properly predict the low frequency plateau for the storage modulus, which is generally observed in polymer blends containing core-shell-type impact modifiers. In the present study, further experiments have been carried out on ABS polymers with different rubber content to verify the validity of our linear viscoelastic model. It has been found that our model describes quite properly the rheological behavior of ABS polymers with different rubber content, especially at low frequencies. The experimental data confirm that our model describes the rheological properties of rubber-modified thermoplastic polymers with strong adhesion at the particle/matrix interface more accurately than the Palierne model.

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Seismic study of buildings with viscoelastic dampers

  • Pong, W.S.;Tsai, C.S.
    • Structural Engineering and Mechanics
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    • 제3권6호
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    • pp.569-581
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    • 1995
  • In this paper, the seismic behavior of a 10-story building equipped with viscoelastic dampers is analyzed. The effects of ambient temperature, the thickness, the total area, and the position of the viscoelastic dampers are studied. Results indicate that the energy-absorbing capacity of viscoelastic damper decreases with increasing the ambient temperature. The thickness and the total area of viscoelastic dampers also affect the seismic mitigation capacity. The thickness cannot be too small, which is not effective in vibration reduction, nor can it be too large, which not only increases the cost but also reduces the seismic resistance. The total area of viscoelastic dampers should be determined properly for optimum damper performance at the most economical design. The mounting position of viscoelastic dampers also influences the structure's seismic performance. Numerical results show that, if properly equipped, the VE dampers can reduce the structural response both floor displacement and story shear force and increase the overall level of damping in structures during earthquakes.

모세관 다이에서 고무 복합체의 점탄성 거동에 대한 컴퓨터 모사 (Computer Simulation of Viscoelastic Flow in a Capillary Die for Rubber Compounds)

  • 박동명;김학주;윤재룡;류민영
    • Elastomers and Composites
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    • 제41권4호
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    • pp.223-230
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    • 2006
  • 고무복합체는 높은 점탄성 성질을 보이는데 압출성형 시 이 점탄성 성질 때문에 압출물이 팽창하게 된다. 그리고 팽윤양은 공정 조건에 따라서 변한다. 점탄성 성질에서 탄성 부분은 압출물의 팽창에 있어서 중요한 역할을 한다. 본 논문은 모세관 다이에서 여러 가지 고무복합체에 따른 다이팽윤을 알아보기 위해 상용 CFD 프로그램인 Polyflow를 사용하여 해석을 수행하였다. 컴퓨터 모사에서는 비선형 미분 점탄성 모델인 Phan-Thien-Tanner(PTT) 모델을 사용하였고 온도를 고러하여 해석하였다. 해석을 통해서 레저버와 모세관 다이에서 압출물의 압력, 속도, 그리고 온도 분포 등을 예측하였다. 여러 가지 고무 복합체의 다이 팽윤양을 알아보기 위해서 유량과 모세관 다이의 지름을 변경하면서 연구하였다. 본 연구를 통해서 PPT 모델은 고무 복합체에 대한 점탄성 거동을 잘 표현하고 있음을 확인할 수 있었다.

유리단섬유로 보강된 분사식 섬유보강 복합재료의 인장거동에 관한 미세역학 기반 해석 (Micromechanics-based Analysis on Tensile Behavior of the Sprayed FRP Composites with Chopped Glass Fibers)

  • 양범주;하성국;이행기
    • 한국전산구조공학회논문집
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    • 제25권3호
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    • pp.211-217
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    • 2012
  • 본 연구에서는 유리단섬유로 보강된 분사식 섬유보강 복합재료의 인장거동 평가를 위한 실험 및 해석연구를 수행하였다. 이를 위해 다양한 변형율속도(strain rate)에 따른 에폭시수지 및 분사식 섬유보강 복합재료의 인장강도 실험을 수행하였다. 본 연구에 사용된 분사식 섬유보강 복합재료는 15mm 길이로 절단된 유리단섬유가 25% 부피비율로 혼입된 보수 보강용 재료이다. 에폭시수지의 점탄성 특성을 고려하기 위해 역산모델링(inverse simulation)을 수행하여 변형율속도에 따른 점성변화를 함수식으로 제안하였다. 역산모델링을 통해 제안된 함수식을 미세역학 기반의 점탄성 손상모델(micromechanics-based viscoelastic damage model; Yang et al., 2012)에 적용하여 분사식 섬유보강 복합재료의 인장거동을 수치적으로 해석하였다. 분사식 섬유보강 복합재료의 인장거동 해석결과와 실험결과를 비교하여 미세역학 기반의 점탄성 손상모델의 정확성을 검증하였다.

Dynamic response of curved Timoshenko beams resting on viscoelastic foundation

  • Calim, Faruk Firat
    • Structural Engineering and Mechanics
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    • 제59권4호
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    • pp.761-774
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    • 2016
  • Curved beams' dynamic behavior on viscoelastic foundation is the subject of the current paper. By rewritten the Timoshenko beams theory formulation for the curved and twisted spatial rods, governing equations are obtained for the circular beams on viscoelastic foundation. Using the complementary functions method (CFM), in Laplace domain, an ordinary differential equation is solved and then those results are transformed to real space by Durbin's algorithm. Verification of the proposed method is illustrated by solving an example by variating foundation parameters.

반도체 칩의 접착계면에 발생하는 열응력 해석 (Analysis of Thermal Stresses Developed in Bonding Interface of Semiconductor Chip)

  • 이상순
    • 한국전산구조공학회:학술대회논문집
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    • 한국전산구조공학회 1999년도 가을 학술발표회 논문집
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    • pp.437-443
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    • 1999
  • This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to uniform temperature change. The viscoelastic film has been assumed to be thermorheologically simple. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The order of the free-edge singularity has been obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

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방진용 고무를 이용한 가새형 감쇠기의 진동 특성에 관한 실험 연구 (Experimenal Study of Dynamic Characteristics of Brace-Typed Dampers using Vibration-resistant Rubbers)

  • 민경원;김진구;조한묵;이성경;호경찬
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 1998년도 춘계학술대회논문집; 용평리조트 타워콘도, 21-22 May 1998
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    • pp.381-385
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    • 1998
  • Vibration-resistant rubbers, whose elastic and shear behaviors are similar to viscoelastic materials, are used to make brace-typed dampers to reduce the building vibration. Experimental study is carried out to find the vibration characteristics of the dampers installed in the building model. The natural frequencies and modal damping ratios are obtained from the free vibration test and Fourier analysis. Analytical model of the modal strain energy method are used to find the viscoelastic characteristics of the brace-typed dampers from the experimental results. Finally shaking table test is performed to find the response behavior of the building model under earthquake loading. The present experimental study shows that the brace-typed dampers have the behavior of viscoelastic dampers, which increase the modal damping ratios and viscoelastic characteristics.

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반도체 칩 접착 계면에 존재하는 모서리 균열 거동에 대한 점탄성 해석 (Viscoelastic Analysis for Behavior of Edge Cracks at the Bonding Interface of Semiconductor Chip)

  • 이상순
    • 한국전산구조공학회논문집
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    • 제14권3호
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    • pp.309-315
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    • 2001
  • 탄성 반도체 칩과 점탄성 접착제층의 계면에 존재하는 모서리 균열에 대한 응력확대계수를 조사하였다. 이러한 균열들은 자유 경계면 부근에 존재하는 응력 특이성으로 인해 발생할 수 있다. 계면 응력상태를 해석하기 위해서 시간 영역 경계요소법이 사용되었다. 작은 크기의 모서리 균열에 대한 응력확대계수가 계산되었다. 점탄성 이완으로 인해 응력확대계수의 크기는 시간이 경과함에 따라 작아진다.

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Delamination analysis of inhomogeneous viscoelastic beam of rectangular section subjected to torsion

  • Victor I. Rizov
    • Coupled systems mechanics
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    • 제12권1호
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    • pp.69-81
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    • 2023
  • This paper considers a delamination analysis of a statically undetermined inhomogeneous beam structure of rectangular section with viscoelastic behavior under torsion. The beam is built in at its two ends. The beam has two longitudinal inhomogeneous layers with a delamination crack between them. A notch is made in the upper crack arm. The external torsion moment applied on the beam is a function of time. Under these conditions, the beam has one degree of indeterminacy. In order to derive the strain energy release rate, first, the static indeterminacy is resolved. Then the strain energy release rate is obtained by analyzing the balance of the energy with considering the viscoelastic behavior. The strain energy release rate is found also by analyzing the compliance of the beam for checkup. Solution of the strain energy release rate in a beam without a notch in the upper crack arm is derived too. In this case, the beam has two degrees of static indeterminacy (the torsion moment in the upper crack arm is treated as an additional internal redundant unknown). A parametric investigation of the strain energy release rate is carried-out.