• Title/Summary/Keyword: various substrate

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A Simple and Accurate Parameter Extraction Method for Substrate Modeling of RF MOSFET (간단하고 정확한 RF MOSFET의 기판효과 모델링과 파라미터 추출방법)

  • 심용석;양진모
    • Proceedings of the Korea Society for Industrial Systems Conference
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    • 2002.11a
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    • pp.363-370
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    • 2002
  • A substrate network model characterizing substrate effect of submicron MOS transistors for RF operation and its parameter extraction with physically meaningful values are presented. The proposed substrate network model includes a single resistance and inductance originated from ring-type substrate contacts around active devices. Model parameters are extracted from S-parameter data measured from common-bulk configured MOS transistors with floating gate and use where needed with out any optimization. The proposed modeling technique has been applied to various-sized MOS transistors. Excellent agreement the measurement data and the simulation results using extracted substrate network model up to 30㎓

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Substrate Temperature Effects on Structural and Optical Properties of RF Sputtered CdS Thin Films

  • Hwang, Dong-Hyeon;Choe, Jeong-Gyu;Son, Yeong-Guk
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.218.2-218.2
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    • 2013
  • In this study, CdS thin films were deposited onto glass substrates by radio frequency magnetron sputtering. The films were grown at various substrate temperatures in the range of 100 to $250^{\circ}C$. The effects of substrate temperatures on the structural and optical properties were examined. The XRD analysis revealed that CdS films were polycrystalline and retained the mixed structure of hexagonal wurtzite and cubic phase. The percentages of hexagonal structured crystallites in the films were seen to be increased by increasing substrate temperatures. The film grown at $250^{\circ}C$ showed a relatively high transmittance of 80% in the visible region, with an energy band gap of 2.45 eV. The transmittance date analysis indicated that the optical band gap was closely related to the substrate temperatures.

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The Wetting Property of Sn-3.5Ag Eutectic Solder (Sn-3.5Ag 공정 솔더의 젖음특성)

  • 윤정원;이창배;서창제;정승부
    • Journal of Welding and Joining
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    • v.20 no.1
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    • pp.91-96
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    • 2002
  • Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.

Molecular Dynamics Study on Behaviors of Liquid Cluster with Shape and Temperature of Nano-Structure Substrate (나노구조기판의 형상 및 온도변화에 따른 액체 클러스터의 거동에 대한 분자동역학적 연구)

  • Ko, Sun-Mi;Jeong, Heung-Cheol;Shibahara, Masahiko;Choi, Gyung-Min;Kim, Duck-Jool
    • Journal of ILASS-Korea
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    • v.13 no.1
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    • pp.34-41
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    • 2008
  • Molecular dynamic simulations have been carried out to study the effect of the nano-structure substrate and its temperature on cluster laminating. The interaction between substrate molecules and liquid molecules was modeled in the molecular scale and simulated by the molecular dynamics method in order to understand behaviors of the liquid cluster on nano-structure substrate. In the present model, the Lennard-Jones potential is applied to mono-atomic molecules of argon as liquid and platinum as nano-structure substrate to perform simulations of molecular dynamics. The effect of wettability on a substrate was investigated for the various beta of Lennard-Jones potential. The behavior of the liquid cluster and nano-structure substrate depends on interface wettability and function of molecules force, such as attraction and repulsion, in the collision progress. Furthermore, nano-structure substrate temperature and beta of Lennard-Jones potential have effect on the accumulation ratio. These results of simulation will be the foundation of coating application technology for micro fabrication manufacturing.

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The Effect of Substrate Bias Voltage during the Formation of BN film by R. F. Sputtering Method (RF 스퍼터링법에 의한 BN박막 증착시 기판 바이어스전압의 영향에 관한 연구)

  • 이은국;김도훈
    • Journal of the Korean institute of surface engineering
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    • v.29 no.2
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    • pp.93-99
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    • 1996
  • In this work BN thin films were deposited on Si substrate by R. F. sputtering method at $200^{\circ}C$ and in Ar + $N_2$ mixed gas atmosphere. In order to investigate the effect of ion bombardment on substrate for c-BN bonding, substrate bias voltage was applied. The optimum substrate bias voltage for c-BN bonding was determined by FTIR analysis on specimens which were deposited with various bias voltages. Then BN thin film was deposited with this optimum condition and its phase, morphology, chemical composition, and refractive index were compared with those of BN film which was deposited without bias voltage. FTIR results showed that BN films deposited with substrate bias voltage were composed of mixed phases of c-BN and h-BN, while those deposited without bias voltage were h-BN only. When pure Ar gas was used for sputtering gas, BN films were delaminated easily from substrate in air, while when 10% $N_2$ gas was added to the sputtering gas, although c-BN specific infrared peak was reduced, delamination did not occur. GXRD and TEM results showed that BN films were amorphous phases regardless of substrate bias voltage, and AES results showed that the chemical compositions of B/N were about 1.7~1.8. The refractive index of BN film deposited with bias voltage was higher than that without bias voltage. The reason is believed to be the existence of c-BN bonding in BN film and the higher density of film that deposited with the substrate bias voltage.

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Effect of Water Content in the Substrate of the Scion and Rootstock during Pre- and Post-Grafting Period on the Survival Rate and Quality of Tomato Plug Seedlings (접목 전후 대목과 접수의 상토 내 수분함량이 토마토 플러그묘의 접목 활착율과 묘소질에 미치는 영향)

  • Vu, Ngoc-Thang;Choi, Ki Young;Kim, Il-Seop
    • Journal of Bio-Environment Control
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    • v.23 no.3
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    • pp.199-204
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    • 2014
  • This study evaluated the effect of water content in the substrate during pre- and post-grafting period on the survival rate and quality of tomato plug seedlings. Nine combinations of three water levels (high, medium, and low) were set up in the substrate of both scion and rootstock. The water content in the substrate of the scion did not affect the survival rate of grafted tomato seedlings, while the survival rate was statically different among the various water contents in the substrate of the rootstock. The maximum survival rates (100%) were observed in seedlings treated with high water levels in the substrate of the rootstock, and the survival rates declined with decreasing water content in the rootstock substrate. The growth characteristics were not significantly affected by different water content in the scion substrate, while they were statically different among the seedlings treated with various water contents in the rootstock substrate. The growth characteristics decreased with decreasing water content in the rootstock substrate. The highest value of compactness was observed in grafted seedlings, which combined medium water level in the scion and high water level in the rootstock substrate treatment. The root morphology of tomato seedlings was also affected by water content in the rootstock substrate. The total root surface area, total root length, and number of root tips decreased with deceasing water content in the rootstock substrate.

Effects of the Substrate Temperature on the Properties of Ni-Zn-Cu Ferrite Thin Films Deposited by RF Magnetron Sputtering (RF Magnetron Sputtering에 의해 증착된 Ni-Zn-Cu Ferrite 박막의 물성에 미치는 기판온도의 영향)

  • 공선식;조해석;김형준;김경용
    • Journal of the Korean Ceramic Society
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    • v.29 no.5
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    • pp.383-390
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    • 1992
  • We investigated the effect of substrate on the properties of the Ni-Zn-Cu ferrite thin films deposited on SiO2 (1000∼3000${\AA}$) / Si (100) substrate at various conditions by rf magnetron sputtering. A disktype Ni-Zn-Cu ferrite sintered by conventional ceramic process and argon gas were used as a target and a sputtering gas, repectively. The compositions of the thin films measured by EPMA were similar to target composition (Fe: 65.8 at%, Ni: 12.7 at%, Cu: 6.7 at%, Zn: 14.8 at%) irrespective of substrate temperature. Amorphous thin films were deposited when substrate was not intentionally heated, but the films came to crystallize with increasing substrate temperature, and crystalline thin films were deposited at substrate temperature above 200$^{\circ}C$. Below 250$^{\circ}C$ saturation magnetization (Ms), remanence (Mr) and coercivity (Hc) of the ferrite thin film increased with the substrate temperature due to the increase of grain size and the improvement of crystallinity. And above 250$^{\circ}C$, Ms, Mr increased slightly, but Hc of the amorphous thin films increased due to crystallization, whereas that of the crystalline thin films decreased because of grain growth and stress release.

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Study on RF power dependence of BST thin film by the different substrates (기판에 따른 BST 박막의 RF Power 의존성)

  • 최명률;이태일;박인철;김홍배
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.22-25
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    • 2002
  • In this paper, we deposited MgO buffer layer on p-type (100)Si substrate in the condition of substrate temperature 400$^{\circ}C$, working gas ratio Ar:O$_2$=80:20, RF Power 50W, working pressure 10mtorr, and the thickness of the film was about 300${\AA}$. Then we deposited Ba$\sub$0.5/Sr$\sub$0.5/TiO$_3$ thin film using RF Magnetron sputtering method on the MgO/Si substrate in various RF power of 25W, 50W, 75W. The film deposited in 50W showed the best crystalline from the XRD measurement. To know the electrical properties of the film, we manufactured Al/BSTMgO(300${\AA}$)/Si/Al structure capacitor. In the result of I-V measurement, The leakage current density of the capacitor was lower than 10$\^$-7/A/$\textrm{cm}^2$ at the range of ${\pm}$150kV/cm. From C-V characteristics of the capacitor, can calculate the dielectric constant and it was 305. Finally we deposited BST thin film on bare Si substrate and (100)MgO substrate in the same deposition condition. From the comparate of the properties of these samples, we found the properties of BST thin film which deposited on MgO/Si substrate were better than on bare Si substrate and similar to on MgO substrate.

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High-Performance Metal-Substrate Power Module for Electrical Applications

  • Kim, Jongdae;Oh, Jimin;Yang, Yilsuk
    • ETRI Journal
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    • v.38 no.4
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    • pp.645-653
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    • 2016
  • This paper demonstrates the performance of a metal-substrate power module with multiple fabricated chips for a high current electrical application, and evaluates the proposed module using a 1.5-kW sinusoidal brushless direct current (BLDC) motor. Specifically, the power module has a hybrid structure employing a single-layer heat-sink extensible metal board (Al board). A fabricated motor driver IC and trench gate DMOSFET (TDMOSFET) are implemented on the Al board, and the proper heat-sink size was designed under the operating conditions. The fabricated motor driver IC mainly operates as a speed controller under various load conditions, and as a multi-phase gate driver using an N-ch silicon MOSFET high-side drive scheme. A fabricated power TDMOSFET is also included in the fabricated power module for three-phase inverter operation. Using this proposed module, a BLDC motor is operated and evaluated under various pulse load tests, and our module is compared with a commercial MOSFET module in terms of the system efficiency and input current.

Nucleation of CVD Diamond on Various Substrate Materials

  • Fukunaga, O.;Qiao, Xin;Ma, Yuefei;Shinoda, N.;Yui, K.;Hirai, H.;Tsurumi, T.;Ohashi, N.
    • The Korean Journal of Ceramics
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    • v.2 no.4
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    • pp.184-187
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    • 1996
  • Diamod nucleation by mw assisted CVD was examined various conditions namely, (1) diamond nucleation on variour substrate materials, such as Si, cubic BN, pyrolytic BN and AIN, (2) AST(Activated species transport) method which promote nucleation of diamond on single crystal and polycrystalline alumina substrate was developed. (3) Effect of bias enhancement of nucleation on single crystalline Si was examined, and finally (4) DST (Double step treatment) method was developed to enhance diamond nucleation on Ni. In this method, we separated carbon diffusing process into Ni, carbon precipitating process from the inside of Ni and diamond precipitation process.

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